2016 17th International Conference on Electronic Packaging Technology (ICEPT) 2016
DOI: 10.1109/icept.2016.7583183
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Thermal behavior of microchannel cooled high power diode laser arrays

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Cited by 2 publications
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“…The reason is that the heat dissipation pathway of the front cavity surface is less than the rear cavity surface and the edge of the emitter is affected by the thermal crosstalk of the adjacent emitter is small. The temperature distribution in the vertical direction of the laser bar is shown in Figure 10, which reveals the temperature rise in each layer of the laser bar, indicating that 86.485 %, 3.595 %, and 9.921 % of the total thermal resistance of the device comes from the heat sink, the solder interface, and the laser bar respectively [14]. 13., the heating of all emitters is the same, which means that these emitters have experienced an independent heating process during this period, and there is no temperature difference due to the horizontal diffusion of heat.…”
Section: Steady-state Thermal Behaviormentioning
confidence: 99%
“…The reason is that the heat dissipation pathway of the front cavity surface is less than the rear cavity surface and the edge of the emitter is affected by the thermal crosstalk of the adjacent emitter is small. The temperature distribution in the vertical direction of the laser bar is shown in Figure 10, which reveals the temperature rise in each layer of the laser bar, indicating that 86.485 %, 3.595 %, and 9.921 % of the total thermal resistance of the device comes from the heat sink, the solder interface, and the laser bar respectively [14]. 13., the heating of all emitters is the same, which means that these emitters have experienced an independent heating process during this period, and there is no temperature difference due to the horizontal diffusion of heat.…”
Section: Steady-state Thermal Behaviormentioning
confidence: 99%