State of the art of ultra-thin gold layers: formation fundamentals and applications

Liang, Suzhe; Schwartzkopf, Matthias; Roth, Stephan V.; Müller‐Buschbaum, Peter

doi:10.1039/d2na00127f

Cited by 16 publications

(6 citation statements)

References 132 publications

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“…Owing to the considerations of cost and weight associated with gold, a gold thin film is a rational choice for detection devices. Gold-vapor deposition is the most reliable and widely used method for preparing gold thin films with controlled thicknesses and designed patterns. − However, gold-vapor deposition requires a high-vacuum apparatus and considerable energy consumption and is therefore unfavorable in terms of high-throughput manufacturing and the environmental burden. Gold plating is another method of preparing gold thin films on solid materials.…”

Section: Introductionmentioning

confidence: 99%

Conductive Gold Thin Film Prepared by the Two-Dimensional Assembly of Gold Nanoparticles on a Plastic Surface

Yoshida,

Tsuchii,

Matsumoto

et al. 2024

ACS Appl. Electron. Mater.

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Gold thin films are useful as conductive materials for electrical devices and sensors, owing to their high conductivity and inertness. In the present study, we propose a novel alternative to conventional gold-coating techniques (i.e., gold-vapor deposition and gold plating) to prepare a gold thin film on a plastic surface using a gold colloidal solution. Gold nanoparticles (AuNPs) were immobilized on a plastic surface with a high density of amino groups (two-dimensional assembly of AuNPs) and subsequently grew to form a gold thin film. The growth of the AuNPs was induced using an amino acid as the reducing agent. The selection of the amino acid significantly influenced the growth of the AuNPs and the morphology of the gold thin film. Microscopic observations and absorbance measurements demonstrated the growth and connection of the AuNPs on the surface. The thickness of the gold thin film was limited to between 50 nm and 0.5 μm by varying the growth conditions. The formed film was lustrous and exhibited electrical conductivity comparable to that of a goldvapor deposited surface. Moreover, we successfully micropatterned the gold thin film on the plastic substrate using the present method combined with a microcontact printing method. The results indicate that our approach has significant potential for use in the manufacture of electrical devices and biosensors.

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Section: Introductionmentioning

confidence: 99%

Conductive Gold Thin Film Prepared by the Two-Dimensional Assembly of Gold Nanoparticles on a Plastic Surface

Yoshida,

Tsuchii,

Matsumoto

et al. 2024

ACS Appl. Electron. Mater.

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“…However, the method is only compatible with sputter deposition processes when using differential pumping, which affects the growth conditions significantly. X-ray methods do not suffer from this limitation, and are therefore well established for monitoring industrially relevant sputter deposition processes. − We have combined real-time synchrotron experiments during magnetron sputter deposition and annealing of Pd/amorphous germanium (a-Ge) bilayers. The real-time information during deposition of Pd/a-Ge was obtained using simultaneous X-ray methods and stress monitoring. , The structure formation during subsequent annealing was studied by real-time X-ray diffraction (XRD).…”

Section: Introductionmentioning

confidence: 99%

“…X-ray methods do not suffer from this limitation, and are therefore well established for monitoring industrially relevant sputter deposition processes. 32 − 35 We have combined real-time synchrotron experiments during magnetron sputter deposition and annealing of Pd/amorphous germanium (a-Ge) bilayers. The real-time information during deposition of Pd/a-Ge was obtained using simultaneous X-ray methods and stress monitoring.…”

Section: Introductionmentioning

confidence: 99%

In Situ Study of the Interface-Mediated Solid-State Reactions during Growth and Postgrowth Annealing of Pd/a-Ge Bilayers

Krause

Abadias

Babonneau

et al. 2023

ACS Appl. Mater. Interfaces

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Ohmic or Schottky contacts in micro- and nanoelectronic devices are formed by metal–semiconductor bilayer systems, based on elemental metals or thermally more stable metallic compounds (germanides, silicides). The control of their electronic properties remains challenging as their structure formation is not yet fully understood. We have studied the phase and microstructure evolution during sputter deposition and postgrowth annealing of Pd/a-Ge bilayer systems with different Pd/Ge ratios (Pd:Ge, 2Pd:Ge, and 4Pd:Ge). The room-temperature deposition of up to 30 nm Pd was monitored by simultaneous, in situ synchrotron X-ray diffraction, X-ray reflectivity, and optical stress measurements. With this portfolio of complementary real-time methods, we could identify the microstructural origins of the resistivity evolution during contact formation: Real-time X-ray diffraction measurements indicate a coherent, epitaxial growth of Pd(111) on the individual crystallites of the initially forming, polycrystalline Pd2Ge[111] layer. The crystallization of the Pd2Ge interfacial layer causes a characteristic change in the real-time wafer curvature (tensile peak), and a significant drop of the resistivity after 1.5 nm Pd deposition. In addition, we could confirm the isostructural interface formation of Pd/a-Ge and Pd/a-Si. Subtle differences between both interfaces originate from the lattice mismatch at the interface between compound and metal. The solid-state reaction during subsequent annealing was studied by real-time X-ray diffraction and complementary UHV surface analysis. We could establish the link between phase and microstructure formation during deposition and annealing-induced solid-state reaction: The thermally induced reaction between Pd and a-Ge proceeds via diffusion-controlled growth of the Pd2Ge seed crystallites. The second-phase (PdGe) formation is nucleation-controlled and takes place only when a sufficient Ge reservoir exists. The real-time access to structure and electronic properties on the nanoscale opens new paths for the knowledge-based formation of ultrathin metal/semiconductor contacts.

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“…At the core of the BCP-based lithography is the controlled self-assembly of the engineered polymer, which is composed of two or more chemically distinct polymer blocks, into periodic nanostructures, which can act as templates. , These nanostructures can then further be transferred into the underlying substrate using etching techniques once the BCP is converted into a mask, − e.g., using advanced processing methods such as deep reactive ion etching (DRIE) suitable for the generation of high aspect ratio features with precisely controlled geometries . However, thus far, the number of successful attempts combining well-defined BCP masks with sufficiently high structural stability and reliable anisotropic etching at the nanoscale is limited, and, so far, none have been able to create very high aspect ratio pores at a substrate surface.…”

Section: Introductionmentioning

confidence: 99%

High Aspect Ratio Nanoscale Pores through BCP-Based Metal Oxide Masks and Advanced Dry Etching

Esmeraldo Paiva,

Gerlt,

Läubli

et al. 2023

ACS Appl. Mater. Interfaces

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The reliable and regular modification of the surface properties of substrates plays a crucial role in material research and the development of functional surfaces. A key aspect of this is the development of the surface pores and topographies. These can confer specific advantages such as high surface area as well as specific functions such as hydrophobic properties. Here, we introduce a combination of nanoscale self-assembled block-copolymer-based metal oxide masks with optimized deep reactive ion etching (DRIE) of silicon to permit the fabrication of porous topographies with aspect ratios of up to 50. Following the evaluation of our procedure and involved parameters using various techniques, such as AFM or SEM, the suitability of our features for applications relying on high light absorption as well as efficient thermal management is explored and discussed in further detail.

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State of the art of ultra-thin gold layers: formation fundamentals and applications

Abstract: Fabrication of ultra-thin gold (Au) layers (UTGLs) has been regarded as the key technique to achieve applications with tunable optical response, flexible sensors and electronic devices. Various strategies have been...

Cited by 16 publications

References 132 publications

Conductive Gold Thin Film Prepared by the Two-Dimensional Assembly of Gold Nanoparticles on a Plastic Surface

Conductive Gold Thin Film Prepared by the Two-Dimensional Assembly of Gold Nanoparticles on a Plastic Surface

In Situ Study of the Interface-Mediated Solid-State Reactions during Growth and Postgrowth Annealing of Pd/a-Ge Bilayers

High Aspect Ratio Nanoscale Pores through BCP-Based Metal Oxide Masks and Advanced Dry Etching

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