Stabilization of the Thermal Decomposition of Poly(Propylene Carbonate) Through Copper Ion Incorporation and Use in Self-Patterning

Spencer, Todd; Chen, Yu‐Chun; Saha, Rajarshi; Kohl, Paul A.

doi:10.1007/s11664-011-1518-z

Cited by 12 publications

(9 citation statements)

References 45 publications

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“…The copper surface effect was found with both UV-exposed and non-UVexposed films, as shown in Fig. 14 [28]. Energy-dispersive X-ray spectroscopy measurements showed that the Cu was oxidized, dissolved, and diffused throughout the PPC film during soft-baking and postexposure baking steps.…”

Section: Types Of Polymersmentioning

confidence: 92%

“…Sacrificial polymer can be used on both hybrid substrates (e.g., FR-4, BT, Duroid) and inorganic substrates (Si, SiO 2 , SiN x , and GaAs). They can be encapsulated with a wide variety of overcoat materials such as Avatrel, polyimides, BCB, SU-8, metals, SiO 2 , spin-on glass, and SiN x [27,28].…”

Section: Types Of Polymersmentioning

confidence: 99%

“…Oxygen from the air was the oxidizing agent for copper oxidation [62]. The experimentally measured amount of Cu ions in the PPC film was about 21 ions per polymer chain, each of which contained about 2100 monomers [28]. Uzunlar et al showed that the improved thermal stability on copper surfaces is unique to PPC films with PAGs containing iodonium-based cations, rather than PAGs with noniodonium-based cations (i.e., sulfonium-based cations) [63].…”

Section: Types Of Polymersmentioning

confidence: 99%

“…100 C, (b) evaporating solvent and dissolving copper from the line surface and edges into PPC, where (c) copper diffuses into PPC to form a copper-rich layer, which (d) continues to take up copper and does not decompose when the film is UV exposed, (e) leaving a copper-rich PPC layer encapsulating the line. (Reprinted with permission from Spencer et al [28]. Copyright 2011 by Springer International Publishing AG).…”

Section: Types Of Polymersmentioning

confidence: 99%

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Decomposable and Template Polymers: Fundamentals and Applications

Uzunlar

Schwartz

Phillips

et al. 2016

Journal of Electronic Packaging

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Polymers can be used as temporary place holders in the fabrication of embedded air gaps in a variety of electronic devices. Embedded air cavities can provide the lowest dielectric constant and loss for electrical insulation, mechanical compliance in devices where low-force deformations are desirable, and can temporarily protect movable parts during processing. Several families of polymers have been used as sacrificial, templating polymers including polycarbonates, polynorbornenes (PNBs), and polyaldehydes. The families can be distinguished by chemical structure and decomposition temperature. The decomposition temperature ranges from over 400 °C to below room temperature in the case of low ceiling temperature polymers. Overcoat materials include silicon dioxide, polyimides, epoxy, and bis-benzocyclobutene (BCB). The methods of air-gap fabrication are discussed. Finally, the use of photoactive compounds in the patterning of the sacrificial polymers is reviewed.

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Section: Types Of Polymersmentioning

confidence: 92%

Section: Types Of Polymersmentioning

confidence: 99%

Section: Types Of Polymersmentioning

confidence: 99%

Section: Types Of Polymersmentioning

confidence: 99%

See 2 more Smart Citations

Decomposable and Template Polymers: Fundamentals and Applications

Uzunlar

Schwartz

Phillips

et al. 2016

Journal of Electronic Packaging

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“…Air-gap structures for microelectromechanical systems packaging have been fabricated using PPC with a hybrid organic-inorganic polyhedral epoxycyclohexyl oligomeric silsesquioxanes overcoat on silicon substrates [45]. PPC thermally decomposes by photoacid catalysis in a narrow and useful temperature window completely into volatile products, which diffuse through the polymer membranes [46]. The mechanical support for striplines in Fig.…”

Section: A Fabrication Processmentioning

confidence: 99%

Airgap Interconnects: Modeling, Optimization, and Benchmarking for Backplane, PCB, and Interposer Applications

Kumar

Sharma

Uzunlar

et al. 2014

IEEE Trans. Compon., Packag. Manufact. Technol.

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Frequency and time domain models are developed for backplane (BP), printed circuit board (PCB), and silicon interposer (SI) links using six-port transfer matrices (ABCD matrices) for bumps, vias and connectors, and coupled multiconductor transmission lines for traces. The six-port transfer matrix approach enables easy computation of the transfer function, as well as near-end and far-end crosstalk. The intersymbol interference is accounted for by computing the pulse response for the worst case bit pattern. Furthermore, the models developed here are used to optimize the data-rate and trace width for each of the links, so that the aggregate bandwidth obtained per joule of energy supplied to the link is maximized. The modeling and optimization approach developed here serves as a good platform to compare the air-gap interconnects against BP, PCB, and SI interconnects on lossy dielectrics. It is shown that air-gap interconnects can provide an aggregate bandwidth improvement of 3×-4× for BP links at a comparable energy per bit, and a 5×-9× improvement in aggregate bandwidth of PCB links at the expense of 20% higher energy per bit. For SI links, airgap interconnects are shown to provide a 2×-3× improvement in aggregate bandwidth and a 1×-1.5× improvement in energy per bit.Index Terms-Air-gap interconnects, chip-to-chip interconnects, data-rate and trace-width co-optimization, fine-pitch interconnects, silicon interposer (SI), time-domain modeling.

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