Stability of thin platinum films implemented in high-temperature microdevices

Tiggelaar, Roald M.; Sanders, Remco G.P.; Groenland, A.W.; Gardeniers, Han

doi:10.1016/j.sna.2009.03.017

Cited by 165 publications

(129 citation statements)

References 60 publications

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“…A 1:10 mixture of the curing agent and prepolymer mixture of PDMS is spun onto the wafer surface and cured, following which the entire layer is peeled off. The use of the 50 nm platinum layer enables this step, as platinum has very poor adhesion to silicon (and usually requires chromium or titanium adhesion layers 13,21 ). The lack of an adhesion layer ensures that the platinum with the oxide material on its surface is embedded in the cured PDMS layer (Figure 1d).…”

Section: Resultsmentioning

confidence: 99%

Transparent functional oxide stretchable electronics: micro-tectonics enabled high strain electrodes

et al. 2013

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Fully transparent and flexible electronic substrates that incorporate functional materials are the precursors to realising nextgeneration devices with sensing, self-powering and portable functionalities. Here, we demonstrate a universal process for transferring planar, transparent functional oxide thin films on to elastomeric polydimethylsiloxane (PDMS) substrates. This process overcomes the challenge of incorporating high-temperature-processed crystalline oxide materials with low-temperature organic substrates. The functionality of the process is demonstrated using indium tin oxide (ITO) thin films to realise fully transparent and flexible resistors. The ITO thin films on PDMS are shown to withstand uniaxial strains of 15%, enabled by microstructure tectonics. Furthermore, zinc oxide was transferred to display the versatility of this transfer process. Such a ubiquitous process for the transfer of functional thin films to elastomeric substrates will pave the way for touch sensing and energy harvesting for displays and electronics with flexible and transparent characteristics. INTRODUCTIONNovel micro-and nano-technology applications encompassing plasmonic devices, field effect transistors, light-emitting diodes, sensor networks, electromagnetic components, terahertz metamaterials, energy harvesters and displays are increasingly demonstrated on flexible substrates. 1-7 These applications represent the building blocks of future flexible and transparent device technology incorporating complex circuitry and functionality. In integrating all the applications together to realise powerful and practical technology that is fully transparent, flexible and functional, two major challenges need to be overcome.First, the flexible substrate should ideally be transparent and colourless. A variety of colourless materials such as polyethylene 8 and polydimethylsiloxane (PDMS) 1 and coloured materials such as polyimide (or Kapton) 9 are widely used. The former can withstand only low processing temperatures (o100 1C), while the yellow-brown tinted polyimide can withstand up to B400 1C. The relevance of colourless substrates to flexible device technology is highlighted by the recent research focus on this area. 10,11 Second, functional oxide materials that offer tailored properties need to be integrated. These functional oxides in the form of thin films can be transparent conductive oxides for electrical conduction, ferroelectrics for memories, piezoelectrics for energy harvesting, 12 and semiconductors or dielectrics for high-performance transistors. Almost

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Section: Resultsmentioning

confidence: 99%

Transparent functional oxide stretchable electronics: micro-tectonics enabled high strain electrodes

et al. 2013

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“…Platinum is stable up to~1000°C (Ref. 47), and platinum-based thermocouples are widely used in temperature measurement. The materials used in the construction determine the device sensitivity and also the temperature range.…”

Section: High Temperaturementioning

confidence: 99%

Precision in harsh environments

2016

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Microsystems are increasingly being applied in harsh and/or inaccessible environments, but many markets expect the same level of functionality for long periods of time. Harsh environments cover areas that can be subjected to high temperature, (bio)-chemical and mechanical disturbances, electromagnetic noise, radiation, or high vacuum. In the field of actuators, the devices must maintain stringent accuracy specifications for displacement, force, and response times, among others. These new requirements present additional challenges in the compensation for or elimination of cross-sensitivities. Many state-of-the-art precision devices lose their precision and reliability when exposed to harsh environments. It is also important that advanced sensor and actuator systems maintain maximum autonomy such that the devices can operate independently with low maintenance. The next-generation microsystems will be deployed in remote and/or inaccessible and harsh environments that present many challenges to sensor design, materials, device functionality, and packaging. All of these aspects of integrated sensors and actuator microsystems require a multidisciplinary approach to overcome these challenges. The main areas of importance are in the fields of materials science, micro/nano-fabrication technology, device design, circuitry and systems, (first-level) packaging, and measurement strategy. This study examines the challenges presented by harsh environments and investigates the required approaches. Examples of successful devices are also given.

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“…100 nm of Pd on top of a 15 nm thick tantalum (Ta) adhesion layer were DC magnetron sputtered and patterned via a lift-off process (30 min ultrasonification in acetone bath), resulting in a square pattern. Ta was selected as an adhesion layer for Pd due to its stable performance as an adhesion promoter at high temperatures [104].…”

Section: Immobilization Of the Catalytic Interfacementioning

confidence: 99%

“…Pt has poor adhesion to Si, SiO 2 , Si x N y and, therefore, an adhesion layer is required. Most of the issues related to Pt reliability are due to the degradation of the Pt adhesion layer at elevated temperatures [104]. Thin films of poly-Si do not require an adhesion layer and a high electrical stability is reported [102].…”

Section: Choice Of a Materials For Temperature Sensing 421 Requiremementioning

Stability of thin platinum films implemented in high-temperature microdevices

Cited by 165 publications

References 60 publications

Transparent functional oxide stretchable electronics: micro-tectonics enabled high strain electrodes

Transparent functional oxide stretchable electronics: micro-tectonics enabled high strain electrodes

Precision in harsh environments

Low-power silicon-based thermal sensors and actuators for chemical applications

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