Stability of concentrated emulsions

Schmitt, Véronique; Arditty, S.; Leal-Calderón, Fernando

doi:10.1016/s1573-4285(04)80017-6

Cited by 9 publications

(4 citation statements)

References 40 publications

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“…In addition, the interprecipitate spacing has increased; this suggests Ostwald ripening has occurred. [ 25 ] This can be quantitatively expressed as the average interparticle spacing, which, increased from the pre‐experiment data, confirms the coarsening process.…”

Section: Resultssupporting

confidence: 57%

Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag₃Sn Phase

Shanthi Bhavan,

Pazhani,

Amer

et al. 2024

Adv Eng Mater

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This study investigates the microstructural and phase transformations in Sn‐Ag solder alloys under high‐temperature conditions, utilizing X‐Ray Diffraction (XRD), Scanning Electron Microscopy (SEM), and Electron Backscatter Diffraction (EBSD) analyses. The research addresses the shift from lead‐based solders to lead‐free alternatives, particularly the Sn‐3.5Ag variant, to meet environmental directives. Analytical techniques were employed pre‐ and post‐controlled thermal cycling from 30°C to 180°C, aimed at emulating solder reflow processes. The XRD analysis at room temperature demonstrated pronounced crystalline peaks, suggesting a preferred orientation within the crystal structure. Additionally, the stability in peak positions (2θ values) indicated low lattice strain in the material. Upon heating, peak broadening suggested grain growth and the onset of recrystallization. SEM and EDS analyses corroborated these findings, displaying a fine‐grained, well‐distributed microstructure with a homogenous composition of Sn and Ag elements. EBSD provided insights into the orientation and texture of grains, revealing a weak to moderate texture across the phases. Post‐experiment data indicated a dominant presence of larger grains and significant variation in grain size, with an area‐weighted mean grain size of 68.47 microns and a standard deviation of 8.68 microns, this suggests significant grain growth and coarsening of the Ag3Sn intermetallic compounds. These structural evolutions have crucial implications for the mechanical properties and reliability of the solder alloy in electronic assemblies, underscoring the need for further exploration of lead‐free solder materials in the electronics industry.This article is protected by copyright. All rights reserved.

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Section: Resultssupporting

confidence: 57%

Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag₃Sn Phase

Shanthi Bhavan,

Pazhani,

Amer

et al. 2024

Adv Eng Mater

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“…This would lower the effect of Ostwald ripening and therefore limit particle growth as observed here. However, the Ostwald ripening of emulsions is also characterized by size focusing (the smaller droplets feed the larger ones), 30 which is clearly not the case here in the absence of NP.…”

Section: Discussionmentioning

confidence: 72%

Effect of nanoparticles on spontaneous Ouzo emulsification

Goubault

Iglicki

Swain

et al. 2021

Journal of Colloid and Interface Science

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“…As remarked by Ruckenstein and Prieve, eq 8 is similar to an Arrhenius equation where the maximum height of the interaction potential can be understood as an energy barrier for particle flocculation. Recently, the coalescence frequency per unit area of a concentrated emulsion was also found to depend on an activation barrier through an Arrhenius type equation. − This result suggests that primary minimum flocculation could be considered to be equivalent to coalescence in the population balance of a liquid/liquid dispersion.…”

Section: Magnitude Of the Stability Ratio W And Its Relation To The H...mentioning

confidence: 99%

“…Despite significant advances in the understanding of the coalescence mechanism of deformable droplets, − the phenomenon of Ostwald ripening, − and the scaling behavior of flocculating suspensions, − the prediction of emulsion stability is still very difficult. This limitation is mostly related to the concurrent occurrence of distinct destabilization processes and the fact that they all depend on the surfactant concentration and chemical structure.…”

Section: Introductionmentioning

confidence: 99%

Role of the Secondary Minimum on the Flocculation Rate of Nondeformable Droplets

Urbina-Villalba

García-Sucre

2005

Langmuir

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The kinetic stability of suspensions is usually associated with a decrease in the flux of flocculating particles due to the action of a repulsive potential. However, previous calculations on bitumen drops suggest the possible occurrence of relatively fast aggregation rates in systems with large electrostatic barriers for primary minimum flocculation. This indicates a strong effect of the secondary minimum in the process of aggregation. Here, emulsion stability simulations (ESS) are used to study the aggregation behavior of 11 systems showing different depths of the secondary minimum and three particle sizes. Micron size drops (as those of Bitumen emulsions) usually exhibit deep secondary minima, which rarely occur between nanometer size particles. At high surfactant concentrations, these drops do not coalesce but can still show fast aggregation rates caused by irreversible secondary-minimum flocculation. On the other hand, the extent of coalescence in nanometer-size systems markedly depends on the height of the repulsive barrier. Furthermore, the secondary minimum of these smaller particles is usually shallow, causing reversible aggregation or no aggregation at all. In this article, the consequences of the referred behaviors on the magnitude of the stability ratio are discussed.

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Stability of concentrated emulsions

Cited by 9 publications

References 40 publications

Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag₃Sn Phase

Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag₃Sn Phase

Effect of nanoparticles on spontaneous Ouzo emulsification

Role of the Secondary Minimum on the Flocculation Rate of Nondeformable Droplets

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Stability of concentrated emulsions

Cited by 9 publications

References 40 publications

Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag3Sn Phase

Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag3Sn Phase

Effect of nanoparticles on spontaneous Ouzo emulsification

Role of the Secondary Minimum on the Flocculation Rate of Nondeformable Droplets

Contact Info

Product

Resources

About

Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag₃Sn Phase

Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag₃Sn Phase