Spreading behavior of Sn droplets impacting Cu and stainless steel substrates

Wang, Xiwushan; Yu, Wei-Yuan; Wang, Mingkang; Wang, Fengfeng; Wu, Baolei

doi:10.1016/j.surfin.2022.101790

Cited by 8 publications

(2 citation statements)

References 23 publications

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“…where E tot(complex) , E tot(NO X ) , and E tot(substrate) are the total energies of the complex between the substrate and adsorbate, the isolated adsorbate, and the substrate without adsorbate, respectively. [42][43][44] Negative DE ads indicates that the adsorption structure is thermodynamically stable to form.…”

Section: Computational Methods and Modelsmentioning

confidence: 99%

Computational insight into effective decomposition of NO_X gas pollutants using N-vacancies in graphitic carbon nitride

Yang,

Zhao,

Zhang

2024

J. Mater. Chem. A

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Section: Computational Methods and Modelsmentioning

confidence: 99%

Computational insight into effective decomposition of NO_X gas pollutants using N-vacancies in graphitic carbon nitride

Yang,

Zhao,

Zhang

2024

J. Mater. Chem. A

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“…In electronic packaging technology, solders play a vital role in connecting and supporting electronic components (Wang et al , 2022a; Chen et al , 2014). Cu has a good solderability and is the most common conductor metal in contact with solder.…”

Section: Introductionmentioning

confidence: 99%

Early wetting and interfacial behavior of Sn-based solder on copper substrates with different roughness

Han,

Chen,

Zhang

et al. 2023

SSMT

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Purpose This paper aims to investigate the effect of solder composition and roughness on early wetting behavior and interfacial reaction under atmospheric conditions. Design/methodology/approach High-speed photography is used to observe the early wetting and spreading process of the solder on the substrate in real time. The morphology of intermetallic compounds (IMCs) was observed by scanning electron microscopy, and the composition of IMCs micro bumps was determined by energy dispersive spectroscopy. Findings With a roughness range of 0.320–0.539 µm, the solder is distributed in an elliptical trilinear pattern along the grinding direction. With a roughness range of 0.029–0.031 µm, the solder spreads in the direction of grinding and perpendicular, forming a perfect circle (except in the case of Sn63Pb37 solder). The effect of three types of solder on early wettability is Sn63Pb37 > Sn96.5Ag3Cu0.5 > Sn. The wetting behavior is consistent with the Rn∼t model. The rapid spreading stage (Stage I) is controlled by the interfacial reaction with n1 values between 2.4 and 4. The slow spreading stage (stage II) is controlled by diffusion with n2 values between 4 and 6.7. The size of Cu6Sn5 formed on a rough substrate is greater than that produced on a smooth substrate. Originality/value Investigating the effect of solder composition and roughness on early wettability. This will provide a powerful guide in the field of soft brazing.

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Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate

Wang

et al. 2022

Appl. Phys. A

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Spreading behavior of Sn droplets impacting Cu and stainless steel substrates

Cited by 8 publications

References 23 publications

Computational insight into effective decomposition of NO_X gas pollutants using N-vacancies in graphitic carbon nitride

Computational insight into effective decomposition of NO_X gas pollutants using N-vacancies in graphitic carbon nitride

Early wetting and interfacial behavior of Sn-based solder on copper substrates with different roughness

Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate

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Spreading behavior of Sn droplets impacting Cu and stainless steel substrates

Cited by 8 publications

References 23 publications

Computational insight into effective decomposition of NOX gas pollutants using N-vacancies in graphitic carbon nitride

Computational insight into effective decomposition of NOX gas pollutants using N-vacancies in graphitic carbon nitride

Early wetting and interfacial behavior of Sn-based solder on copper substrates with different roughness

Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate

Contact Info

Product

Resources

About

Computational insight into effective decomposition of NO_X gas pollutants using N-vacancies in graphitic carbon nitride

Computational insight into effective decomposition of NO_X gas pollutants using N-vacancies in graphitic carbon nitride