Early wetting and interfacial behavior of Sn-based solder on copper substrates with different roughness
Yuzhu Han,
Jieshi Chen,
Shuye Zhang
et al.
Abstract:Purpose
This paper aims to investigate the effect of solder composition and roughness on early wetting behavior and interfacial reaction under atmospheric conditions.
Design/methodology/approach
High-speed photography is used to observe the early wetting and spreading process of the solder on the substrate in real time. The morphology of intermetallic compounds (IMCs) was observed by scanning electron microscopy, and the composition of IMCs micro bumps was determined by energy dispersive spectroscopy.
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