Spray-coated carbon nanotube thin-film transistors with striped transport channels

Jeong, Min-ho; Lee, Kunhak; Choi, Eugene; Kim, Ahsung; Lee, Seung‐Beck

doi:10.1088/0957-4484/23/50/505203

Cited by 17 publications

(12 citation statements)

References 21 publications

(36 reference statements)

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“…An alternative methodology that uses stencils to create patterns is spray-coating. By controlling the different spray parameters, it has been possible to deposit and control the characteristics of thin film transistors based on carbon nanotubes (Jeong et al, 2012), ZnO (Lima et al, 2020), and organic semiconductors like 6,13-Bis(triisopropylsilylethynyl)pentacene (TIPS-Pentacene) (Yu et al, 2013) and Poly(9,9-dioctylfluorene-altbithiophene) (F8T2) (Hsu and Liu, 2014). Other functional layers fabricated through spray-coating include perovskites for solar cells (Bishop et al, 2020), MXene for strain sensors Zhang Y.-Z.…”

Section: Fabricationmentioning

confidence: 99%

Flexible Electronics: Status, Challenges and Opportunities

2020

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The concept of flexible electronics has been around for several decades. In principle, anything thin or very long can become flexible. While cables and wiring are the prime example for flexibility, it was not until the space race that silicon wafers used for solar cells in satellites were thinned to increase their power per weight ratio, thus allowing a certain degree of warping. This concept permitted the first flexible solar cells in the 1960s (Crabb and Treble, 1967). The development of conductive polymers (Shirakawa et al., 1977), organic semiconductors, and amorphous silicon (Chittick et al., 1969; Okaniwa et al., 1983) in the following decades meant huge strides toward flexibility and processability, and thus these materials became the base for electronic devices in applications that require bending, rolling, folding, and stretching, among other properties that cannot be fulfilled by conventional electronics (Cheng and Wagner, 2009) (Figure 1). Presently there is great interest in new materials and fabrication techniques which allow for highperformance scalable electronic devices to be manufactured directly onto flexible substrates. This interest has also extended to not only flexibility but also properties like stretchability and healability which can be achieved by utilizing elastomeric substrates with strong molecular interactions (Oh et al., 2016; Kang et al., 2018). Likewise, biocompatibility and biodegradability has been achieved through polymers that do not cause adverse effect to the body and can be broken down into smaller constituent pieces after utilization (Bettinger and Bao, 2010; Irimia-Vladu et al., 2010; Liu H. et al., 2019). This new progress is now enabling devices which can conform to complex and dynamic surfaces, such as those found in biological systems and bioinspired soft robotics. These next-generation flexible electronics open up a wide range of exciting new applications such as flexible lighting and display technologies for consumer electronics, architecture, and textiles, wearables with sensors that help monitor our health and habits, implantable electronics for improved medical imaging and diagnostics, as well as extending the functionality of robots and unmanned aircraft through lightweight and conformable energy harvesting devices and sensors. While conventional electronics are very capable of these functions, flexible electronics are intended to expand the mechanical features to adhere to novel form factors through hybrid strategies, or as standalone solutions where the application does not require high computation power, intended to be highly robust to deformation, low cost, thin, or disposable. The definition of flexibility differs from application to application. From bending and rolling for easier handling of large area photovoltaics, to conforming onto irregular shapes, folding, twisting, stretching, and deforming required for devices in electronic skin, all while maintaining device performance and reliability. While early progress and many important innovations have alre...

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Section: Fabricationmentioning

confidence: 99%

Flexible Electronics: Status, Challenges and Opportunities

2020

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“…[212,213] The interface can be alternatively manipulated with slowly evaporating solvents instead of withdrawing substrates to align SWCNTs. [217][218][219] In addition, the deposition outcome can be further tuned by annealing at suitable substrate temperatures. The viscosity of spray-coated inks has to be low to facilitate the nebulization process for small droplets.…”

Section: Evaporation-based Assemblymentioning

confidence: 99%

“…This technology is especially useful for coating uneven structures, such as steps, trenches, and stacks on semiconductor chips, [216] and can be used to fabricate thin films using nanomaterials, such as SWCNTs, CdTe, or CuInSe 2 nanocrystals. [217][218][219] In addition, the deposition outcome can be further tuned by annealing at suitable substrate temperatures. [220] Blade coating (also known as knife coating or doctor blading) is an easily implementable approach that requires colloidal inks with higher viscosities than the other techniques discussed in this section.…”

Section: Evaporation-based Assemblymentioning

confidence: 99%

Assembly and Electronic Applications of Colloidal Nanomaterials

2016

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Artificial solids and thin films assembled from colloidal nanomaterials give rise to versatile properties that can be exploited in a range of technologies. In particular, solution-based processes allow for the large-scale and low-cost production of nanoelectronics on rigid or mechanically flexible substrates. To achieve this goal, several processing steps require careful consideration, including nanomaterial synthesis or exfoliation, purification, separation, assembly, hybrid integration, and device testing. Using a ubiquitous electronic device - the field-effect transistor - as a platform, colloidal nanomaterials in three electronic material categories are reviewed systematically: semiconductors, conductors, and dielectrics. The resulting comparative analysis reveals promising opportunities and remaining challenges for colloidal nanomaterials in electronic applications, thereby providing a roadmap for future research and development.

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“…В отличие от оксидных прозрачных электродов нанотрубные обладают высокой гибкостью и прозрачностью в ИК-диапазоне. Наиболее перспективными методиками формирования пле-нок ОУНТ большой площади являются spray-метод [10][11][12] и метод микроструйной печати (ink jet) [13].…”

Section: Introductionunclassified