“…In comparison, other materials e.g., Heusler alloys 41,42 , permalloy 10,13,43–45 , and CoFeB 46 have damping at least an order of magnitude higher. However, the preparation of YIG 47–67 and etching or liftoff processes that preserve the properties of the YIG 60,61,66,68–70 present challenges, particularly for integration on a semiconductor platform. Second, to efficiently interconnect SW devices, the waveguides need to be curved or bent.…”