2015
DOI: 10.1134/s1063783415050303
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Specific features of the behavior of electroarc CuO nanoparticles in a magnetic field

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Cited by 21 publications
(10 citation statements)
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“…This is confirmed by a sharp increase (with decreasing temperature) of the difference M ZFC (T) -M FC (T) (inset in Fig. 1) in the temperature range below 100 K. A similar effect was observed by the authors of [6] in the vicinity of the point corresponding to the Neel temperature T N . Despite the fact that the difference M ZFC (T) ˗-M FC (T) is not a strict proof of the transition to the AF state, nevertheless, the surface spins can be exchange-coupled to the AF "core".…”
Section: Results and Analysissupporting
confidence: 83%
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“…This is confirmed by a sharp increase (with decreasing temperature) of the difference M ZFC (T) -M FC (T) (inset in Fig. 1) in the temperature range below 100 K. A similar effect was observed by the authors of [6] in the vicinity of the point corresponding to the Neel temperature T N . Despite the fact that the difference M ZFC (T) ˗-M FC (T) is not a strict proof of the transition to the AF state, nevertheless, the surface spins can be exchange-coupled to the AF "core".…”
Section: Results and Analysissupporting
confidence: 83%
“…According to [3][4][5][6][7] It is known [9,16] that in CuO the exchange interaction is of the order of ~ 400 K, and the short-range ferromagnetic order can be remained up to high temperatures.…”
Section: Results and Analysismentioning
confidence: 99%
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“…The experimental equipment and the dependence of the powder properties on the spraying conditions are discussed. [9][10][11][12] The cathode consists of copper alloy M1 with diameter of 80 mm and length of 100 mm; it was placed on a water-cooled copper current lead. An auxiliary electrode was used to start the pilot arc, as it provided the plasma stream stabilization.…”
Section: Methodsmentioning
confidence: 99%
“…So far, a number of thermal plasma based processes have been developed. Among them, the vacuum arc plasma evaporation (VAPE) method is commonly used for the deposition of thin films [16] and the fabrication of nanoparticles [17][18][19][20][21][22]. We recently reported that particle phases with different stoichiometries, including Cu2O and CuO, can be produced by varying the deposition conditions, such as oxygen partial pressure, discharge power, processing pressure, and substrate temperature [23].…”
Section: Introductionmentioning
confidence: 99%