Spark Plasma Sintering of Functionally Graded SiO₂/Mo Laminated Layer Material

Abstract

A functionally graded sintered body consisting of laminated SiO2/Mo layers was fabricated using spark plasma sintering. A high sintered‐body density was achieved using fine powders of SiO2 (4.0 μm) and Mo (1.3 μm), which ensured no cracks were formed between layers. The highest joining stress (1.2 MPa) was found to occur at the interface between SiO2 layers with 0 and 8 vol% Mo, with the electrical resistance decreasing rapidly when the Mo content was increased to 13 and 22 vol%. This is attributed to the use of spark plasma sintering, suggesting further work is needed to fully optimize this process.

Review on developments of bulk functionally graded composite materials

“…Elemental Ti and TiB 2 were used as the starting powders, and TiB was formed in-situ by chemical reaction during the SPS process. Honma and Tatami [173] fabricated four-layered SiO 2 –Mo FGCMs with the following layer compositions (in vol.-%) – 100SiO 2 /SiO 2 –8Mo/SiO 2 –13Mo/SiO 2 –22Mo. The fabricated FGCM was free from defects such as cracks, voids and delaminations.…”

“…Several recent articles studied the electrical properties of FGCMs [173,174,180,227]. Electrical resistivity of SiO 2 –Mo and Cu–YSZ FGCMs were studied by Honma and Tatami [173] and Mirazimi et al [174], respectively. Both studies reported an increase in the electrical resistivity with increasing ceramic content.…”

“…Several recent articles studied the electrical properties of FGCMs [173,174,180,227]. Electrical resistivity of Figure 46.…”

“…Data points for the thermal conductivity of pure W were collected from [248]. SiO 2 -Mo and Cu-YSZ FGCMs were studied by Honma and Tatami [173] and Mirazimi et al [174], respectively. Both studies reported an increase in the electrical resistivity with increasing ceramic content.…”