2007 Non-Volatile Memory Technology Symposium 2007
DOI: 10.1109/nvmt.2007.4389954
|View full text |Cite
|
Sign up to set email alerts
|

Solid electrolyte memory for flexible electronics

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
6
0

Year Published

2010
2010
2016
2016

Publication Types

Select...
5
1

Relationship

0
6

Authors

Journals

citations
Cited by 6 publications
(6 citation statements)
references
References 8 publications
0
6
0
Order By: Relevance
“…Figure S1 in the Supporting Information describes the fabrication procedures of the 1D-1P devices. To reduce the reset current of the flexible PCM devices, the self-assembly of Si-containing poly(styrene- b -dimethylsiloxane) (PS- b -PDMS) BCPs was introduced because the operation current of conventional PCM device (contact hole size = 2 μm) on plastics is 58 mA, as shown in Supporting Information Figure S2, which not only thermally damage a plastic substrate and intercells but also exceeds the current supply capability of the selection device. , The thermally stable SiO x nanostructures can easily be converted from self-assembled PDMS microdomains after O 2 plasma treatment, ,, as shown in the inset of Figure a. The regularly arranged insulating SiO x nanostructures can be highly beneficial for reducing the contact area between GST and TiN films on plastics, thus resulting in a decrease in the reset current owing to the reduced switching volume.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Figure S1 in the Supporting Information describes the fabrication procedures of the 1D-1P devices. To reduce the reset current of the flexible PCM devices, the self-assembly of Si-containing poly(styrene- b -dimethylsiloxane) (PS- b -PDMS) BCPs was introduced because the operation current of conventional PCM device (contact hole size = 2 μm) on plastics is 58 mA, as shown in Supporting Information Figure S2, which not only thermally damage a plastic substrate and intercells but also exceeds the current supply capability of the selection device. , The thermally stable SiO x nanostructures can easily be converted from self-assembled PDMS microdomains after O 2 plasma treatment, ,, as shown in the inset of Figure a. The regularly arranged insulating SiO x nanostructures can be highly beneficial for reducing the contact area between GST and TiN films on plastics, thus resulting in a decrease in the reset current owing to the reduced switching volume.…”
Section: Resultsmentioning
confidence: 99%
“…Rapid advances in flexible electronics have been recently made for their potential use in paper-like displays, , plastic radio frequency identification (RFID) tags, bioimplantable devices, and other types of electronic devices. To operate flexible electronic devices, however, further performance improvement of flexible memories is a key issue owing to their critical roles in code processing, data storage, and radio frequency communication. Phase-change memory (PCM) is one of the most viable candidates for next-generation nonvolatile flexible memories due to its multiple advantages of excellent cycling endurance, high speed, and outstanding scalability. In the realization of a high-performance flexible PCM, a large writing current is the major obstacle because flexible PCM devices work at a high current, for example, over 50 mA for micrometer contact. The operating current of PCM can be diminished as the switching volume of the phase-change material becomes smaller ( i.e. , a decrease in the power consumption per cell with reduction in device feature size) .…”
mentioning
confidence: 99%
“…The used ink was a conductive organic polymer. Also, the manufacturing process was transferred from a silicon wafer to a cheaper and flexible foil, which allowed for measuring a silicon oxide‐based memristor under physical stress . The new substrate in combination with a thin device setup is of importance because on the one hand, foils are cheap alternatives to silicon substrates.…”
Section: Introductionmentioning
confidence: 99%
“…Consequently such technology could enable the integration of electronic at low-cost in different consumer's goods. In this context, OTFTs has already been demonstrated as enabler for several key applications such as electronic paper (e-paper) [3], smart sensors [4] [5] and information storage devices [6] [7]. The research in the field of organic memory has mainly focused on the development and optimization of innovative organic memories devices, and especially Ferroelectric random access memory [8].…”
Section: Introductionmentioning
confidence: 99%