Solderless interconnection and packaging technique for embedded active components

Kujala, A.; Tuominen, Risto; Kivilahti, J.K.

doi:10.1109/ectc.1999.776164

Cited by 24 publications

(7 citation statements)

References 3 publications

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“…In many applications, the performance of a polymer product is related to its surface properties. An example is a multilayer printed wiring board (PWB), in which dissimilar materials, including various polymers, are sequentially built up to enable high‐density interconnection substrates 1–10. For adequate adhesion between the layers, the surface free energy of a solid polymer has to be high enough to ensure proper wettability 11, 12.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the surface free energy of spin‐coated photodefinable epoxy

Turunen

Laurila

Kivilahti

2002

J Polym Sci B Polym Phys

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The surface free energy of crosslinked photodefinable epoxy (PDE) was evaluated from the advancing contact angles measured by the sessile drop method. Poly(tetrafluoroethylene) (PTFE) was used as a reference material in the evaluation of the surface free energies by various models. Pure water, diiodomethane, formamide, ethylene glycol, diethylene glycol, glycerol, 1-bromonaphthalene, decane, and tetradecane were used as the probing liquids. The surface free energies for PDE and PTFE were calculated to be 43.6 and 21.2 mJ/m 2 , respectively. The contact-angle measurements indicated the isotropy of the PDE surface with respect to the surface free energy. The PDE coating was further characterized with scanning electron microscopy and atomic force microscopy. The PDE surface was treated chemically and by reactive ion etching (RIE) to determine their impact on the wettability and adhesion. The treatments resulted in decreased contact angles between the crosslinked PDE surface and water as the polarity of the surface increased from about 9% to 18 and 43% by the chemical and RIE treatments, respectively. On the contrary, the surface free energy of the treated PDEs, as calculated by the geometric mean model, did not change markedly (to 47.4 and 41.8 mJ/m 2 by the chemical and RIE treatments, respectively). Consequently, the contact angles of diiodomethane and the PDE solution on the treated surfaces did not decrease noticeably. The stud-pull test showed improved adhesion strength for PDE that was left less crosslinked and, therefore, had residual affinity against the sequential PDE layer.

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Section: Introductionmentioning

confidence: 99%

Evaluation of the surface free energy of spin‐coated photodefinable epoxy

Turunen

Laurila

Kivilahti

2002

J Polym Sci B Polym Phys

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“…Major advantage is the reduction of the interconnection layers and thus an increased reliability potential. First results have been described by Kivilahti et al [11] for the embedding of active components onto an organic substrate, encapsulating them and generate a rewiring layer directly on the encapsulant. IZM's Duromer molded interconnect device (MID) technology presented in [12] is taking this approach further by directly applying substrate and encapsulant to the active component.…”

Section: B Volume Processes For Sip/sop Generationmentioning

confidence: 91%

Stackable system-on-packages with integrated components

Becker

Jung

Ostmann

et al. 2004

IEEE Trans. Adv. Packag.

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In recent years, an increasing number of mobile electronic products such as mobile communicators, combining the functions of a mobile phone and a PDA are beginning to emerge. These devices are highly miniaturized and yet provide a variety of functions at ever higher speeds. Additionally, the product cycle time is getting faster, requiring short design and production cycles at ever lower cost. These trends are posing great set of challenges for the microelectronics and packaging and assembly industry. There seem to be two approaches to solve these challenges-system-in-package (SIP) by stacking of packaged integrated circuits (ICs) or system-on-package (SOP) by stacking of packages with embedded active and passive components. The buried components in SOP require significantly less space in z direction, thereby allowing the formation of three-dimensional (3-D) stackable packages. In this paper, two approaches for stacking SOPs were presented, the so-called chip-in-polymer (CIP) technology and duromer molded interconnect device (MID)/WLP technology.Index Terms-Embedded passives, modular systems, molded interconnect device (MID), packaging, system-on-package (SOP).

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“…1,10,19,20 Recently, we have studied the manufacture of integrated optical waveguides and highly miniaturized build-up modules using SU8 and other epoxies and rigid printed wiring boards (PWBs) as substrates. 10,19,21,22 Today, however, flexible PWBs are increasingly being used in high-density applications such as smart cards, hearing aids, displays, and portable electronics. 23 Blending of brittle epoxies like the SU8 24 with a phase-separating polymer is a common approach to the toughening of epoxies.…”

Section: Introductionmentioning

confidence: 99%

Reactive blending approach to modify spin‐coated epoxy film: Part I. Synthesis and characterization of star‐shaped poly(ϵ‐caprolactone)

Turunen

Laurila

Kivilahti

2006

J of Applied Polymer Sci

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ABSTRACT:To effectively modify the properties of an epoxy, branched oligomers were synthesized from -caprolactone (CL) and end-functionalized to realize network precursors that can be reactively blended with the epoxy. The ring-opening polymerization (ROP) of the CL in the presence of polyglycerol (PGL) initiator (3.9 and 9.1 mol %) and Sn(II) 2-ethylhexanoate catalyst yielded oligomers with hydroxyl end-groups, which were converted to carboxylic acid functionality by reaction with succinic anhydride. The functionalized oligomers had a four-armed structure and the molecular weight of the oligomers could be controlled by the ratio of CL to PGL in the feed. To achieve an adequately crosslinked network in the reactive blending, a dual-catalyzed reaction scheme was employed. First the oligomer was incorporated into the epoxy matrix in an imidazole-catalyzed reaction and then the crosslinking was completed with an acid-catalyzed ROP of the residual epoxies. Investigations showed that toughened coatings could be prepared from the inherently brittle epoxy through proper choice of the blending ratio of oligomer to epoxy. The blending increased surface hydrophobicity at high concentrations of functionalized oligomer, but did not have an adverse effect on the inherently advantageous endothelial cell spreading.

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Solderless interconnection and packaging technique for embedded active components

Cited by 24 publications

References 3 publications

Evaluation of the surface free energy of spin‐coated photodefinable epoxy

Evaluation of the surface free energy of spin‐coated photodefinable epoxy

Stackable system-on-packages with integrated components

Reactive blending approach to modify spin‐coated epoxy film: Part I. Synthesis and characterization of star‐shaped poly(ϵ‐caprolactone)

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