2015
DOI: 10.1016/j.proeng.2015.01.505
|View full text |Cite
|
Sign up to set email alerts
|

Soldering of Copper with High-temperature Zn-based Solders

Abstract: The work deals with the study of interaction Cu substrate (purity 5N) and Zn4Al and Zn6Al6Ag (purity 4N) solders for higher application temperatures. Soldering was performed with power ultrasound in the air without flux application at temperature 420 °C. Acting time of ultrasonic vibration was 5 s. Soldered joints were assessed by optical light microscopy, EDX microanalysis and DSC analysis. It was found out that the melting temperatures of solders were 404.9 °C and 396.9 °C. Intermetallic layers (IM) CuZn 4 a… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

3
7
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
7
2
1

Relationship

0
10

Authors

Journals

citations
Cited by 22 publications
(10 citation statements)
references
References 13 publications
3
7
0
Order By: Relevance
“…The purpose of this section is to obtain usable brazing joints. This paper does not intend to find the optimal welding process parameters, but focuses on the previous joint design [ 18 ]. In the experiment, scratch brazing was utilized to connect 1060 pure aluminum and H62 brass.…”
Section: Scratch Brazing Of Specimenmentioning
confidence: 99%
“…The purpose of this section is to obtain usable brazing joints. This paper does not intend to find the optimal welding process parameters, but focuses on the previous joint design [ 18 ]. In the experiment, scratch brazing was utilized to connect 1060 pure aluminum and H62 brass.…”
Section: Scratch Brazing Of Specimenmentioning
confidence: 99%
“…Ag is 39 MPa. The results also showed that the brazing melting temperature was 404.9 °C and 396.9 °C [5]. Another researcher was used NH2 on PC61BM properties using density functional theory (DFT) [6].…”
Section: Introductionmentioning
confidence: 98%
“…Deep etching can be done by using a high concentration of acid solution to scrape the surface of the brazed area [4]. The occurrence of fundamental physical-chemical processes on the surface of the base material is a prerequisite for getting a correctly constructed soldered joint that meets the prescribed operating requirements [5]. It is crucial to first acquire the best wettability and spread-ability of the used solders in order to enable capillary phenomena and a tight filling of the soldering gap with liquid solder [6].…”
Section: Introductionmentioning
confidence: 99%