Soldering of 7075 Aluminum Alloy Using Ni-P and Cu-Cr Electrodeposited Interlayers

Abstract

Direct soldering of the aluminum alloy 7075 is very difficult or even impossible. In order to make it possible, galvanic coatings and the procedures for their application on alloy surfaces were developed. The paper presents structures and mechanical properties of soldered joints of the 7075 alloy, made in indirect way with use of electrolytically deposited Ni-P and Cu-Cr coatings. Application of the newly developed Ni-P and Cu-Cr coatings on base surfaces of the 7075 alloy is described. The results of wettability examination of the S-Sn97Cu3 solder in the droplet test and by spreading on the coatings applied on the 7075 substrates are presented. The wettability angle of both coatings was lower than 30°. The results of metallographic examinations with use of light and electron microscopy are presented. It was shown that adhesion of metallic coatings to the aluminum alloy is good, exceeding shear strength of the S-Sn97Cu3 solder. Shear strength of soldered joint was equal to 35 ± 3 MPa. Measured hardness of the Ni-P interlayer reached high value of 471 HV 0.025.