Abstract:To have a better understanding of the wetting behavior of Sn-based solders on the aluminum substrate, s series of comparative experiments with Sn, Sn-3.5Ag (SA), and Sn-3.0Ag-0.5Cu (SAC305) were performed by direct heating on the hot plate with normal flux in the air. The wetting morphology was measured by the cross-section images using a scanning electron microscope (SEM), and the intermetallic compounds, at the interface after heating, were identified by the phase diagram calculated by the FactSage, and conf… Show more
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