Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions

Chen, Y. S.; Wang, C. S.; Wang, T. C.; Chan, Wei-Ping; Chang, Kuo-Chin; Yuan, T. D.

doi:10.1007/s11664-006-0026-z

Cited by 7 publications

(3 citation statements)

References 4 publications

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“…Chen et al showed that solder mask size affects the monotonic bend performance [10]; they found that for FCBGA component after the cyclic bend performance with larger solder mask opens show three times better bend performance than small pad size; however, the authors did not clarify the solder mask type. Lim et al observed that the failure mechanism and failure mode are different between the solder mask defined (SMD) and nonsolder mask defined (NSMD) design in BGA solder ball shear test, with solder ball crack in SMD design, and laminate cratering in NSMD design [11].…”

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confidence: 99%

Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints

Lee

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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Sn-Ag-Cu (SAC) solder alloys, such as Sn-3.0Ag-0.5 Cu (SAC305) are the popular choices of lead-free solders replacing SnPb solders. However, SAC solders are more brittle in nature due to stiffness and excessive intermetallic compounds growth at the solder joint to pad interface. This leads to higher risk of solder joints failures. Memory module-type smaller lead-free ball grid array (BGA) packages are constantly under dynamic stresses during handling and thermal stresses during operations. It is important to understand the dynamic performance and long-term reliability of memory module lead-free BGAs. It is believed that the printed circuit board (PCB) design variations cause dynamic and long-term failure discrepancies in the fields. In this paper, different pad and trace designs are introduced to evaluate the effects of PCB design variations on the bend and accelerated thermal cycling (ATC) performance of lead-free solder joints. Pad designs with nonsolder mask defined, solder mask defined (SMD), and a unique web design are assembled and tested. Different solder alloys, including SAC305, Sn-1.0Ag-0.5Cu (SAC105) SAC105, and SnPb solders, have been evaluated in this paper. Different PCB materials have also been evaluated in the test. Four-point monotonic bend tests are performed to characterize the bending performance variations with different PCB designs and compared with conventional Sn-Pb solder. The SMD pad is shown to have the best bend performance among all other types of designs in this paper. In addition, this design also shows improvement in mitigation of PCB pad cratering with lead-free solders. Wide trace width seems to degrade the strength and is not preferred. Just as it shows superior shock resistance when compared with SAC305, the SAC105 solder alloy also shows better bend performance. There is no significant improvement in bend performance with web design. After aging treatment, bend performance of both SAC305 and SAC105 degraded by up to 34% and 29%, respectively. However, the bend performance of eutectic SnPb is actually improved after aging. ATC tests are performed to investigate the effects of design variations on the long-term reliability of lead-free solder joints; SMD design shows less reliability life than others. The implications of these results for the reliability of lead-free solder joints are discussed in this paper.Index Terms-Accelerated thermal cycling (ATC), ball grid array (BGA), lead-free, pad design, reliability, solder.

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confidence: 99%

Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints

Lee

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…The finite element analysis is needed, first, to evaluate the stress and strain states of the interconnections during loading since their measurement is nearly impossible due to the sizes the interconnections and, second, to establish a correlation between the lifetime under accelerated tests and the lifetime under operation conditions. Therefore, the possibilities to mimic the drop loading condition with the (monotonic or cyclic) four-point bending test have been studied [60][61][62][63][64]. The advantage of the four-point bending setup is that the board behavior would be much more simplified.…”

Section: Methods Of Shock Impact Testingmentioning

confidence: 99%

Board‐Level Reliability of Lead‐Free Solder under Mechanical Shock and Vibration Loads

Matilla¹,

Marjamäki²,

Kivilahti³

2011

Structural Dynamics of Electronic and Photonic Systems

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“…The FE modeling methods for predicting the lifetime of SnPb and SnAgCu solder joints under thermomechanical cycling conditions were found to offer more accurate results by means of combining constitutive law with a proper fatigue model (Ridout and Bailey, 2007). It was realized that the location of failure of lead-free solder interconnects between silicon chip and substrate under the monotonic bending test is dependent upon the combinations of opening sizes of solder mask and the categories of solder materials (Chen et al, 2007). A similar testing approach is applied in the bending fatigue reliability of lead-free and halogen-free packaging assemblies (Jonnalagadda et al, 2005).…”

Section: Introductionmentioning

confidence: 99%

Lead‐free solder joint reliability estimation of flip chip package using FEM‐based sensitivity analysis

Lee

Chang

Yang

2009

Soldering &Amp; Surface Mount Technology

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Purpose -Integration of Cu/low-k interconnects into the next-generation integrated circuit chips, particularly for devices below the 90 nm technology node, has proved necessary to meet the urgent requirements of reducing RC time delay and low power consumption. Accordingly, establishment of feasible and robust packaging technology solutions in relation to the structural design, as well as material selection of the packaging components, has become increasingly important. Moreover, the nature of low-k materials and the use of lead-free solder greatly increases the complications in terms of ensuring enhanced packaging level reliability. The foregoing urgent issue needs to be quickly resolved while developing various advanced packages. This paper aims to focus on the issues. Design/methodology/approach -The prediction model, especially for the fatigue life of lead-free solder joints, combined with virtual design of experiment with factorial analysis was used to obtain the sensitivity information of selecting geometry/material parameters in the proposed low-k flipchip (FC) package. Moreover, a three-dimensional non-linear strip finite element model associated with the two levels of specified boundary condition of global-local technique was adopted to shorten the time of numerical calculation, as well as to give a highly accurate solution. Findings -The results of thermal cycling in experimental testing show good agreement with the simulated analysis. In addition, the sensitivity of analysis indicates that the type of underfill material has a significant effect on the lead-free solder joint reliability. Originality/value -A suitable combination of concerned designed factors is suggested in this research to enhance the reliability of low-k FC packaging with Pb-free solder joints.

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Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions

Cited by 7 publications

References 4 publications

Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints

Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints

Board‐Level Reliability of Lead‐Free Solder under Mechanical Shock and Vibration Loads

Lead‐free solder joint reliability estimation of flip chip package using FEM‐based sensitivity analysis

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