Solder joint fatigue life of fine pitch BGAs – impact of design and material choices

Darveaux, Robert; Heckman, Jim; Syed, Ahmer; Mawer, Andrew

doi:10.1016/s0026-2714(00)00038-x

Cited by 40 publications

(23 citation statements)

References 2 publications

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“…Besides, the von-Mises stress of solder joint just underneath the die is around 156 MPa. For most experiment results, it was found [19] that the row of joints just outside or just underneath the die edge failed first; this substantiates the present simulation results. For instance, the solder ball root will form the nucleation of initial crack and degrade the thermal cycle life time.…”

supporting

confidence: 89%

Simulation Investigations on Fluid/Structure Interaction in the Reflow Soldering Process of Board-Level BGA Packaging

Abdullah¹

2013

IJCTE

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Abstract-The objective of the present study is to develop a Fluid/Structure Interaction model of a board-level Ball Grid Array (BGA) assembly for an infrared-convection reflow oven. The infrared-convection reflow oven is modeled in Computational Fluid Dynamic (CFD) software while the structural heating BGA package simulation is done using Finite Element Method (FEM) software. Both software applications are coupled bidirectional using the Multi-physics Code Coupling Interface (MpCCI). The simulation thermal profile is compared with the experiment thermal profile, and they were found to be in good conformity. The simulated flow fields show that the convection mode in an infrared-convection reflow oven played minor effect on heat transfer to the printed circuit board (PCB). The dominant heat transfer mode in an infrared-convection reflow oven is the radiation mode from a quartz heating tube. From the simulation results, the PCB near the edges or corners tended to heat up first at preheating, soaking and reflow stages. The PCB and component experience larges temperature difference in preheating stage. This situation runs the risk of an excessive board warpage. In addition, the maximum von-Mises stress is trapped in the interfaces between solder joint and die, which intend to form the nucleation of initial solder joint crack. This guideline is very useful for the accurate control of temperature and thermal stress distributions within components and PCB, which is one of major requirements to achieve high reliability of electronic assemblies.Index Terms-Ball grid array assembly, infrared-convection reflow oven, computational fluid dynamic, finite element method. I. INTRODUCTIONReflow soldering process has been affected by miniaturization of electronic packages and complicated thermal-mechanical design of a printed circuit board (PCB) assembly. Additional challenge is presented with environmental concerns propelling a rising trend toward lead-free soldering. A lead-free solder requires a narrower range of flow temperatures and workable melt compared with a lead-based solder. Using an inadequate reflow profile may not only result in a high level of thermal stress in the package, but may also result in excessive PCB warpage [1]. Those defects can then result in significant reliability issues in the electronic industry. In recent years, a simulation tool for the reflow soldering process greatly helps the electronic manufacturing industry [1]. Therefore, a prediction of the thermal response of the soldering process is crucial for initial parameter design. The popular thermal response analysis at the package level is based on the finite-element method (FEM). Shen et al. [2] and Inoue and Koyanagawa [3] built the FEM model to obtain the temperature distribution of a ball grid array (BGA) package for the reflow process. The average heat-transfer coefficient (h avg ) was calculated using experimental equations for multiple impinging jets. However, the experimental results obtained by Illé s [4], [5] showed that the heat transfe...

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supporting

confidence: 89%

Simulation Investigations on Fluid/Structure Interaction in the Reflow Soldering Process of Board-Level BGA Packaging

Abdullah¹

2013

IJCTE

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“…Sample 7 and sample 8 have same variables except the die size and the solder ball diameter. [1] We speculate the mismatch in Fig. 6 the exclusion of the die size in the fatigue life equation.…”

Section: Case Studymentioning

confidence: 87%

“…The standard of failure in this study is defined as the first failure life cycle. [1], [6], [7], [8] The C.O.Vs of varying boundary condition listed in Table 2 are taken from some reference. Fig.…”

Section: Case Studymentioning

confidence: 99%

“…Also, the package variables including the die size, the package size, the ball count, the pitch, the mold compound and the substrate material affect the failure life of solder joints. [1] However, it is not easy to consider all of the variables. In this study, the material of solder joint, the materials of substrates, the height of solder, the Distance of the solder joint from the Neutral Point (DNP), the temperature variation and the dwell time were considered.…”

Section: Introductionmentioning

confidence: 99%

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Reliability estimation of solder joints under thermal fatigue with varying parameters by using FORM and MCS

2008

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Abstract-One of major reasons of failure of solder joints is known as the thermal fatigue. Also, The failure of the solder joints under the thermal fatigue loading is influenced by varying boundary conditions such as the material of solder joint, the materials of substrates(related the difference in CTE), the height of solder, the Distance of the solder joint from the Neutral Point (DNP), the temperature variation and the dwell time. In this paper, first, the experimental results obtained from thermal fatigue test are compared to the outcomes from theoretical thermal fatigue life equations. Second, the effects of varying boundary conditions on the failure probability of the solder joint are studied by using the probabilistic methods such as the First Order Reliability Method (FORM) and Monte Carlo Simulation (MCS).

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“…Only a few references in literature reveal the impact of the use of Green Mould Compounds [3,4,5]. The main trends are summarised in Table 1.…”

Section: Introductionmentioning

confidence: 99%

Green mould compounds: Impact on second level interconnect reliability

Vandevelde

Lofrano

Willems

2011

2011 IEEE 13th Electronics Packaging Technology Conference

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The change-over from conventional to so-called green moulding compounds has gradually taken place in the last five years. These green mould compound materials have a lower thermal expansion and higher elastic modulus. As a consequence of the modified thermal and mechanical properties, an impact on the thermo-mechanical behaviour of the package-board assembly is expected (so-called Package Board Interaction: PBI). The CTE difference between the package and the board increases introducing the green mould compounds.This paper discusses the impact of the use of green moulding compounds to the second level solder joint fatigue cracking. The comparison with non-green mould compounds used in the past is done by experiments for TSOP's and by finite element modelling studies for a wide range of packages. The study reveals that the impact of the transition to green mould compound is substantial and can lead to early solder joint fatigue failures in applications.The paper also shows that tests on flexible PCB's underestimate the impact. In particular for assembly on rigid boards the mean life time may reduce to 20% of the life time obtained for non-green moulded packages IntroductionThe last decade new electronic materials are being introduced by component, PCB manufacturers and assembly plants to cope with the IC-technology evolution, the environmental legislation (RoHS) and the "going green" trend driven by market pressure. Two major changes associated with this migration are the elimination of lead and halogens in electronics.One of these trends has been the replacement of the mould compound of plastic packaged IC-components by so-called "Green Mould Compounds" (GMC) which are usually halogen-free, hence the name. The change-over has gradually taken place in the period between 2006 and 2010 and has reached a very high penetration level without being noticed by most of the component users. Although these new mould compounds have many environmental and technical benefits (less moisture absorption, improved die compatibility), they may endanger the reliability of electronics significantly.A high amount of research resources has been spent on the selection of new 'leadfree' solders and what their impact is on the long term reliability of the second level assemblies [1]. It was clear from the beginning that the change from SnPb solder to leadfree solder had a major impact on the reliability as the stiffness, yield strength, creep behaviour and resistance to fatigue fracture of these new materials are different.

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Solder joint fatigue life of fine pitch BGAs – impact of design and material choices

Cited by 40 publications

References 2 publications

Simulation Investigations on Fluid/Structure Interaction in the Reflow Soldering Process of Board-Level BGA Packaging

Simulation Investigations on Fluid/Structure Interaction in the Reflow Soldering Process of Board-Level BGA Packaging

Reliability estimation of solder joints under thermal fatigue with varying parameters by using FORM and MCS

Green mould compounds: Impact on second level interconnect reliability

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