Metal
oxide semiconductors are important due to their diverse set
of applications in (opto)electronics including light-emitting diodes,
solar cells, and thin film transistors (TFTs). However, compared to
their n-type counterparts, p-type oxide thin films are less often
reported, and there is a need for increased fundamental understanding
of their process-structure–property relationships. In this
study, p-type CuO
x
was grown by plasma-enhanced
atomic layer deposition (PE-ALD) using different ratios of hydrogen
and oxygen plasma and a nonfluorinated copper amidinate precursor.
This approach, combined with postdeposition annealing, enables tuning
of the phase, oxidation state, and morphology of the films. Here,
we comprehensively investigate the coupled relationships between:
(1) PE-ALD process parameters; (2) oxidation state, composition, and
grain size; and (3) electronic properties of the films. Synchrotron
X-ray absorption spectroscopy was performed to quantify the copper
oxidation states. By varying the hydrogen:oxygen plasma ratio, the
phase of CuO
x
can be controlled to form
Cu, Cu2O, or CuO. Vacuum annealing resulted in an increase
in grain size and reduction in copper oxidation state. To study the
p-type semiconductor behavior, bottom-gate TFTs were fabricated, demonstrating
characteristic I–V behavior with an on/off current ratio of
∼105 for the film with the largest Cu(I) fraction
and largest grain size.