Sol–gel synthesized linear oligosiloxane-based hybrid material for a thermally-resistant light emitting diode (LED) encapsulant

Abstract

Sol-gel synthesized linear oligosiloxane-based hybrid material for a thermally-resistant light emitting diode (LED) encapsulant

Preparation and Performance of Poly(butyl fumarate)-Based Material for Potential Application in LED Encapsulation

“…In recent years, light-emitting diodes (LEDs) have increasingly been used for a variety of lighting applications [ 1 , 2 , 3 ]. They have attracted great interest because of their advantages in terms of high efficiency, low power consumption, environmental benefits, among other factors [ 4 , 5 , 6 ].…”

“…Phenyl-siloxane hybrid materials show remarkable thermal resistance against yellowing, compared with silicone encapsulants. Nevertheless, they have low optical transparency [ 3 ]. Acryl or epoxy polymers have low thermal resistance, due to the absence of siloxane bonds.…”

UV-curable ladder-like diphenylsiloxane-bridged methacryl-phenyl-siloxane for high power LED encapsulation

“…The encapsulant is a key material protecting the circuits of a LED from moisture, contaminants, thermal and mechanical damage. [9][10][11][12][13][14][15][16][17][18][19] The magnicent prospects of high power LEDs provide a great chance for polysiloxanes. SiEns with high transparency, high RI and durability in harsh environments are crucial for high power LEDs to gain the desired light extraction efficiency (LEE) and life time.…”

P‐117: Sol‐Gel Derived and Thermally Cured Siloxane Encapsulated Quantum Dot Hybrid Material with Excellent Stabilities

“…Previously, we reported sol-gel synthesized linear structured siloxane hybrid material for LED encapsulant. [9] The fabricated siloxane hybrid LED encapsulant is cured by hydrosilylation reaction of vinyl-phenyl siloxane hybrid (matrix) and hydrogen-phenyl siloxane hybrid (cross-linker). [10] The siloxane LED encapsulant showed excellent thermal stability over 180 ℃ for 1000 hours and high optical transparency.…”