Soft magnetic properties and heat stability for Fe/NiFe superlattices

Investigation of Different Ferrous Concentration Effect on Characteristics of NiFeP Nano Alloy Thin Films

“…Electrodeposition of NiFeP alloy films were prepared with electrolyte baths consisting Ferrous sulphate (10,20,30, 40 g/L), Nickel sulphate (50 g/L), Ammonium formate (40 g/L), Phosphorus Acid (10 g/L ), Citric acid (10 g/L) and operating at temperature (30 o C) .The solution pH was adjusted to 6.0 by adding NH 4 OH and electro deposition was carried out at current density 2 mA/cm 2 and electro deposition time duration was 15 min. In this investigation, Cu and steel alloy substrates acted as cathode and anode respectively with dimension 7.5 cm x 1.5 cm [6][7][8][9] .…”

“…Electro deposition is a important growth technique involving the materials deposition from an electrolyte bath by passing electric current at particular temperature and pressure. Important features of this method are cost-effectiveness, ability to deposit materials on substrates with complex geometries and easy control of the composition [15][16][17][18][19] . In addition, electro deposition allows morphology, composition and thickness of the deposited thin films by varying deposition parameters like temperature, current density, pH value and plating time [20][21][22] .…”

“…Important features of this method are cost-effectiveness, ability to deposit materials on substrates with complex geometries and easy control of the composition [15][16][17][18][19] . In addition, electro deposition allows morphology, composition and thickness of the deposited thin films by varying deposition parameters like temperature, current density, pH value and plating time [20][21][22] . The nickel ferrous alloy have been used in storage and recording devices in electronics, transformer with medium response sensitivity for residual current devices, pulse transformers, shielding for low temperature measurement and transducers [23][24][25][26][27][28] .…”

Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate

“…Spincoating has wafer edge effect where airflow would be perturbed, resulting in non-uniformity in coating thickness if the substrate is not circular, and production of chuck mark by thermal communication between the solution on the top of the wafer and the metal vacuum chuck on the back side of the wafer. In addition, NiFe thin films could be fabricated by ultra-high vacuum evaporator at 100 • C but the grain size is in the range of 200-500 nm [8]. On the other hand, pulse electrodeposition has the ability to generate high power density at target surface, higher deposition rate and precise deposition control.…”

“…NiFe films have been deposited using various standard deposition techniques such as electrodeposition [2][3][4][5], sputtering [6,7], ultra-high vacuum evaporator [8], pulse laser deposition system (PLD) [9], metal oxide chemical vapor deposition (MOCVD) [10] and spin-coating [11]. PLD system is expensive and needs high heating rate of target surface.…”