2022
DOI: 10.1016/j.est.2022.106136
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Soft fully-printed rGO/Fe2O3-based supercapacitors for wearable electronics

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Cited by 12 publications
(9 citation statements)
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“…S6b†), which proves that Fe element has been chemically bonded to the oxygen-containing functional groups on the surface of CNTs and PGNs. 14,29 In Fig. 2e, the Fe 2p 3/2 and Fe 2p 1/2 peaks at 711.5 and 725.1 eV, respectively, can be ascribed typically to Fe 2 O 3 with a peak separation of 13.6 eV, which is in agreement with previous reports.…”
Section: Resultssupporting
confidence: 92%
See 1 more Smart Citation
“…S6b†), which proves that Fe element has been chemically bonded to the oxygen-containing functional groups on the surface of CNTs and PGNs. 14,29 In Fig. 2e, the Fe 2p 3/2 and Fe 2p 1/2 peaks at 711.5 and 725.1 eV, respectively, can be ascribed typically to Fe 2 O 3 with a peak separation of 13.6 eV, which is in agreement with previous reports.…”
Section: Resultssupporting
confidence: 92%
“…Combining highly conductive carbon materials with pseudocapacitive materials in the hope of leveraging their respective advantages has proved effective in further improving the overall specific capacitance of flexible materials. [14][15][16][17][18] Among various pseudocapacitive materials, Fe 2 O 3 is a potential negative electrode material owing to its high capacity, wide voltage window, non-toxicity, eco-friendliness, cost-effectiveness, abundant reserves, and facile synthesis. 19,20 Ni(OH) 2 , considered a versatile positive electrode material, possesses a theoretical specific capacitance as high as 2082 F g −1 .…”
Section: Introductionmentioning
confidence: 99%
“…However, an uneven spacing position assembling of the rGO structure is commonly generated in the solution process due to the interlayer force interactions and equilibrium, which brings an unstable electrical property of the rGO structure, which in turn leads to the problem of poor mechanical properties of the assembly layer, unstable electrical properties such as resistance and conductivity, , and difficulty in preparing a high-precision electronic device . In addition, although some studies have proposed the use of inkjet printing, screen printing, , and 3D printing to directly use GO inks to assemble the structure, it is easy to find that has certain drawbacks in these studies. For example, due to the structure of an inkjet printing machine, the diameter of the ink sheet must be very small; otherwise, it will block the printing nozzles.…”
Section: Introductionmentioning
confidence: 99%
“…Thus, solid-state flexible devices are introduced, and they have received much attention as a recent growing technology in energy storage systems. 22–25 The upper hand of flexible supercapacitors (FSC) is in terms of small dimensions of fabrication, 26 low weight, 27 better operability conditions, 28 excellent reliability, 29 and better thermal stability. 30 The benefits of using solid/gel polymer electrolytes in flexible devices are less binder requirement, mechanical flexibility, fast charge/discharge times, and better reversibility.…”
Section: Introductionmentioning
confidence: 99%