2002
DOI: 10.1002/adfm.200290009
|View full text |Cite
|
Sign up to set email alerts
|

Soft Contact Deposition onto Molecularly Modified GaAs. Thin Metal Film Flotation: Principles and Electrical Effects

Abstract: We describe and analyze a process to position a ∼ 1 nm thick molecular layer between two solid surfaces without damage to the molecules. The method is used to deposit a metal film in a soft, gentle manner on a semiconductor, yielding functional semiconductor/molecule/metal junctions. It is a combination of the lift‐off procedure, known from, for example, lithography, and the bonding process, known from, for example, wafer bonding. The combined method may find application also outside the area described here. W… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

6
129
0

Year Published

2007
2007
2023
2023

Publication Types

Select...
7
3

Relationship

1
9

Authors

Journals

citations
Cited by 104 publications
(137 citation statements)
references
References 59 publications
(78 reference statements)
6
129
0
Order By: Relevance
“…[69,70] Electrochemical deposition of Cd and Pb on methylÀSi(111) was reported to preserve the electrical properties of the monolayer, [68] i.e., which we know now to imply that the junction remained inverted. Atomic layer deposition (ALD) is at present the most promising alternative to non-vacuum deposition methods that are non-invasive, [188] such as Hg, [63,133,154,189] LOFO, [64,87,190] PALO, [191] MoPALO. [20,192] Chemical reactivity across the monolayer explains also why Hg works well with Si or Ag substrate but not with, e.g., Au (amalgamation).…”
Section: Sources Of Defects and How To Avoid Themmentioning
confidence: 99%
“…[69,70] Electrochemical deposition of Cd and Pb on methylÀSi(111) was reported to preserve the electrical properties of the monolayer, [68] i.e., which we know now to imply that the junction remained inverted. Atomic layer deposition (ALD) is at present the most promising alternative to non-vacuum deposition methods that are non-invasive, [188] such as Hg, [63,133,154,189] LOFO, [64,87,190] PALO, [191] MoPALO. [20,192] Chemical reactivity across the monolayer explains also why Hg works well with Si or Ag substrate but not with, e.g., Au (amalgamation).…”
Section: Sources Of Defects and How To Avoid Themmentioning
confidence: 99%
“…gold Au contacts were used to measure the J-V characteristics 17,18 . The Au contact J-V curve overlaps that obtained with Hg despite the work function difference.…”
mentioning
confidence: 99%
“…Since the emergence of this field, 2,3 it has expanded greatly and now includes several types of device configuration (e.g., two-terminal junctions [4][5][6][7] , three-terminal junctions 8 and electrochemical devices 9 ), where the molecules serve as direct current carriers 10 or indirectly affect the electrical properties of a junction 11,12 .…”
Section: Introductionmentioning
confidence: 99%