Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide

Abstract

We investigated the soft baking condition effect on residual solvent amount, decomposition of photo sensitive diazonaphthoquinone group, photosensitivity, and development loss amount of positive photosensitive polyimide, which composed of partial esterified poly(amic acid) and photosensitive diazonaphthoquinone sulfonate. After soft baking, 10-14% of solvent was remained. Below 120°C baking, the naphthoquinone group was remained more than 90%. More than 40% of the naphthoquinone group was decomposed when 130°C baking. Photosensitivity seems to be determined by development loss of photosensitive polyimide. 120°C for 4min is suitable soft baking condition in this study.

A Computational Probe into the Dissolution Inhibitation Effect of Diazonaphthoquinone Photoactive Compounds on Positive Tone Photosensitive Polyimides

“…The DNQ PACs I-1 and III-1 were selected to prepare experimentally. These PACs were obtained from 1,2,5-DNQ with TOB and THPE, respectively, in a molar ratio of 1:3, according to a reported method . The prepared DNQ PACs were named as I-1_E and III-1_E .…”

Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications

“…Next, the sample was developed by cyclopentanone and rinsed by propylene glycol monomethyl ether acetate (PGMEA) at room temperature to form the lithography pattern. After the lithography process, the sample was cured at 280 °C for 1 hour by the oven (Yotec, DH-400N) under N2 atmosphere to complete the imidization of polyimide [14], [15].…”

Photosensitive Polyimide for Packaging Applications

“…Conventional positive-tone photosensitive polyimide is composed of alkali soluble polyimide precursor and napthoquinonediazide photosensitive compound (DNQ) [3,4]. To complete imidization, it requires to be heated more than 300℃, and it has high residual stress.…”