Photosensitive Polyimide for Packaging Applications

Tomikawa, Masao; Okuda, Ryoji; Ohnishi, Hiroyuki

doi:10.2494/photopolymer.28.73

Cited by 26 publications

(7 citation statements)

References 5 publications

(6 reference statements)

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“…Next, the sample was developed by cyclopentanone and rinsed by propylene glycol monomethyl ether acetate (PGMEA) at room temperature to form the lithography pattern. After the lithography process, the sample was cured at 280 °C for 1 hour by the oven (Yotec, DH-400N) under N2 atmosphere to complete the imidization of polyimide [14], [15].…”

Section: A Lithography Test Of Pspimentioning

confidence: 99%

Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications

Huang,

Hu,

Liu

et al. 2024

IEEE J. Electron Devices Soc.

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In advanced packaging schemes, such as fanout integration technology, photosensitive polyimide (PSPI) is the key material to the fabrication of panel level redistribution-layer (RDL). However, a large mismatch of coefficient of thermal expansion (CTE) between silicon (Si) and PSPI will cause serious warpage issue. Furthermore, polyimide deformation may occur under external heat and pressure, leading to deterioration of RDL reliability. In this work, PSPI with low CTE and excellent adhesion strength on different substrate was developed and evaluated by lithography test, adhesion test, and reliability test, showing the high feasibility for the application in advanced packaging process.

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Section: A Lithography Test Of Pspimentioning

confidence: 99%

Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications

Huang,

Hu,

Liu

et al. 2024

IEEE J. Electron Devices Soc.

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“…Conventional positive-tone photosensitive polyimide is composed of alkali soluble polyimide precursor and napthoquinonediazide photosensitive compound (DNQ) [5]. In the conventional procedure for producing a polyimide, it was required to be heated up to 300 °C to complete imidization, leading to high shrinkage, outgassing, and high residual stress.…”

Section: Preparation and Pattern Formation Of Pspimentioning

confidence: 99%

Development of Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide with High Elongation

Shoji

Koyama

Masuda

et al. 2016

J. Photopol. Sci. Technol.

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Recently, progress of semiconductor packaging is drastic and multi-pinned devices such as Fan-out Wafer Level Packages (FOWLPs) attract much attention. For those applications, photosensitive polyimides (PSPIs) are applied as redistribution layers (RDLs) and they are required to have high level of properties such as adhesion to metal and reliability. We developed novel low-temperature curable positive-tone photosensitive polyimides (posi-PSPIs) with high elongation, strong adhesion to the copper RDLs, and high chemical resistance for establishing the multi RDLs by improving the base-polyimides and incorporating polyimides with cross-linkers and adhesion promoters.

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“…Hence, photosensitive organic materials with low residual stress have been developed as interlayer dielectrics for semiconductor devices [2][3][4][5][6][7][8][9][10][11][12][13][14][15]. Recently, Shoji et al had reported that a photosensitive preimidized polyimide (PI) with low residual stress is developed by introducing special soft segment and utilizing low temperature curable crosslinker [2].…”

Section: Introductionmentioning

confidence: 99%

Development of Positive Tone-Type Photosensitive Materials Based on A Phenolic Resin with A Low Coefficient of Thermal Expansion

Doi,

Shimokawa

2024

J. Photopol. Sci. Technol.

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We had previously developed a novel negative tone-type photosensitive material that can be patterned by photolithography, based on a chemically amplified system containing a phenolic resin, a crosslinker, and a photochemical acid generator (PAG). It exhibits a low coefficient of thermal expansion and low residual stress after thermally treated at 260 °C. However, when photolithography was performed to form micro-scale hole patterns on a thin film of the photosensitive material, the resin's high absorbance caused overhung profile was observed and which was considered to lead to difficulty in subsequent metal wiring formation on the film. In this study, the normally tapered pattern formation was tried by applying positive tone-type photosensitive materials. The hydroxy groups of phenolic resin were protected by acid cleavable and/or hydrophobic substituents and the protected resin was mixed with the PAG for creating the chemically amplified positive tone-type photosensitive material. We also investigated the photolithography, the effect of heat treatment conditions on residual stress, and the light transmittance and solvent solubility of the resins. We found that the substitution of the side groups with tert-butyl acetate was effective in the formation of normally tapered patterns by photolithography and observed low residual stress of the thin film after heat treatment at 260 °C. This material is a good candidate as an interlayer dielectric for semiconductor devices and wafer-level microfluidic materials for cooling semiconductor chips.

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Photosensitive Polyimide for Packaging Applications

Cited by 26 publications

References 5 publications

Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications

Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications

Development of Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide with High Elongation

Development of Positive Tone-Type Photosensitive Materials Based on A Phenolic Resin with A Low Coefficient of Thermal Expansion

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