Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact

Lin, Kwang‐Lung; Hsu, Hui-Min

doi:10.1007/s11664-001-0131-y

Cited by 49 publications

(28 citation statements)

References 23 publications

(23 reference statements)

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“…This is similar to a previous observation of Al-containing solder that was an "inherent barrier" solder. 20 An inherent barrier solder refers to a solder that can provide a barrier layer through its capability of forming an intermetallic layer with the substrate metal. The, thus formed IMC has the characteristic of a diffusion barrier that inhibits the interdiffusion between substrate metal and other solder constituent elements.…”

Section: Resultsmentioning

confidence: 99%

“…18,19 Aluminum was found to exhibit "inherent barrier" behavior between Cu and solder. 20 The Gibbs free energy of formation of the Cu-Al intermetallic is greater than that of Cu-Zn and Cu-Sn intermetallics. A layer of the Cu-Al intermetallic compound existing between Cu and solder inhibits further interdiffusion between Cu and solder constituent elements.…”

Section: Introductionmentioning

confidence: 98%

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Wetting interaction between Sn-Zn-Ag solders and Cu

Lin

Shih

2003

Journal of Elec Materi

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The wetting interaction of Sn-(7.1-9)Zn-(0-3)Ag solders with Cu was investigated from 230°C to 300°C. The wetting time, wetting forces, and activation energy of the wetting reaction were studied. The wetting time decreases with increasing temperature and increases with Ag content. The wetting force exhibits a disproportional correlation to temperature rise, while no trend was observed with respect to Ag content. The wetting behavior was ascribed to the interaction between Cu and Zn. The AgZn 3 compound was formed at the interface when the solder contains 0.3% Ag and above, while it was formed within the bulk solder at 2% Ag and above.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 98%

Wetting interaction between Sn-Zn-Ag solders and Cu

Lin

Shih

2003

Journal of Elec Materi

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“…19 Nevertheless, the Cu-Al-Zn layer does not exist at the interface between Cu and the solder. The Ag-Zn compound is not a continuous layer (Figs.…”

Section: Imc Formation Between Various Metallizations Andmentioning

confidence: 99%

“…A fractional addition of Al into the Sn-Zn and Sn-Zn-Ag solders gave rise to congregation of Al at the interface to form a Cu-Al-Zn IMC layer. 19,20 The Cu-Al-Zn IMC layer acted as a diffusion barrier that retards interdiffusion between Sn and Cu.…”

Section: Introductionmentioning

confidence: 99%

The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates

Chuang

Hung

Liu

et al. 2004

Journal of Elec Materi

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The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-0.1Al solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial IMC layers formed between the Cu and Sn-Zn-Ag-GaAl solder, while Cu-Zn and Au-Al-Zn IMCs formed on the Cu/Au substrate. Only the Au-Al-Zn IMC formed at the interface when the electroless Ni-P deposit was the diffusion barrier between Cu and the Au surface layer.

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“…Additionally, this alloy's lower cost per mass unit compared to that of SAC solders meets the low-cost demand of the electronics industry. However, because of the corrosion of Zn [3] and low wear resistance [4], Sn-Zn alloys are often modified with alloying additions, such as Ag [5][6][7], Al [4,8,9], Bi [10], In [11,12], Ga [13] and Cu [14,15]. For the Sn9Zn (wt.%)-based alloys with Ag additions were found to be suitable for the soldering of Cu and Al [16].…”

Section: Introductionmentioning

confidence: 99%

Characteristics Of Sn-Zn Cast Alloys With The Addition Of Ag And Cu

Gancarz¹,

Pstruś²

2015

Archives of Metallurgy and Materials

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CharaCterIstICs of sn-Zn Cast alloys wIth the addItIon of ag and Cu Charakterystyka odlanyCh stopów sn-Zn Z dodatkIem ag I CuThe aim of this work was to study the effects of Ag and Cu on the thermal properties and microstructure of Sn-Zn-AgCu cast alloys. Solders based on eutectic Sn-Zn containing 0.5 to 1.0 at.% of Ag and Cu were developed for wave soldering. DSC measurements were performed to determine the melting temperatures of the alloys. TMA and electrical resistivity measurements were performed between -50 and 150°C and between 30 and 150°C, respectively. Small precipitates of Cu5Zn8, CuZn4, and AgZn3 were observed in the microstructures, and their presence was confirmed by XRD measurements. The inclusion of Ag and Cu improved the electrical resistivity and increased the melting temperature, as well as the CTE, of the alloys. However, tests performed to measure the mechanical properties of the alloys demonstratedthat the addition of Ag and Cu caused the mechanical properties to decrease.Keywords: Sn-Zn-Ag-Cu, CTE, electrical resistivity, lead-free solders, XRD, microstructure of cast alloysCelem pracy było zbadanie wpływu dodatku Ag i Cu na właściwości termiczne i mikrostrukturę stopów sn-ZnAg-Cu. stopy lutownicze na bazie eutektyki sn-Zn zawierające od 0,5 do 1,0 % at. Ag oraz Cu zostały opracowane do lutowania falowego. Pomiary DsC wykonywano w celu określenia temperatury topnienia stopów. Badania współczynnika rozszerzalności liniowej przeprowadzono w temperaturach -50 i 150 °C, a oporu elektrycznego od 30 do 150 °C. W mikrostrukturze zaobserwowano drobne wydzielenia Cu5Zn8, CuZn4 i AgZn3, a ich obecność potwierdzono pomiarami XrD. Dodatek Ag i Cu do eutektyki snZn obniża rezystywność elektryczną, a podnosi temperaturę topnienia oraz współczynnik rozszerzalności liniowej stopów. Przeprowadzone badania mechaniczne odlanych stopów wykazały, że dodanie Ag oraz Cu spowodowało obniżenie właściwości mechanicznych.

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Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact

Cited by 49 publications

References 23 publications

Wetting interaction between Sn-Zn-Ag solders and Cu

Wetting interaction between Sn-Zn-Ag solders and Cu

The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates

Characteristics Of Sn-Zn Cast Alloys With The Addition Of Ag And Cu

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