The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates

Abstract

The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-0.1Al solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial IMC layers formed between the Cu and Sn-Zn-Ag-GaAl solder, while Cu-Zn and Au-Al-Zn IMCs formed on the Cu/Au substrate. Only the Au-Al-Zn IMC formed at the interface when the electroless Ni-P deposit was the diffusion barrier between Cu and the Au surface layer.

Simultaneous Determination of Trace Heavy Metals in Natural Water by Portable Metal Analyzer

“…The latter changes are due to the formation of a Cu-Ga intermetallic [5].The observed behavior is explained by the fact that the Cu-Ga compound has a larger formation constant than the Cu-Zn intermetallic. This type of behavior has been observed for other intermetallics involving Ga(II) [6,7].…”

Interfacial microstructure and shear behavior of Sn–Ag–Cu solder balls joined with Sn–Zn–Bi paste

“…However, in this study, Au is identified in the Ag-Au-Cu-Zn compounds. The phenomenon may be ascribed to the presence of Zn in the Sn-based solder because Au can easily react with Zn [28][29][30]. In our previous study [31], AgZn 3 and AuZn 3 may coexist in Ag-Au-Cu-Zn phase with Cu dissolution by XRD diffraction pattern.…”

Interfacial Reactions of Sn-3.5Ag-xZn Solders and Cu Substrate During Liquid-State Aging

“…25 In addition, both Cu 5 Zn 8 and Ag 5 Zn 8 compounds are of the same space group: I43(217) with Pearson symbol CI52. 27 Therefore, Ag atoms diffused to the Cu 5 Zn 8 phase and could be incorporated into it. The atomic radii of Zn and Cu are 0.133 nm and 0.128 nm, respectively.…”