Sn-Pb and lead free solders containing active carbon particles

Talaş, Şükrü; Gökçe, Barış; Çakmakkaya, Mehmet

doi:10.1088/1757-899x/146/1/012043

Cited by 2 publications

(2 citation statements)

References 13 publications

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“…approximately 27% decrease with the addition of 0.003 wt% active carbon and finally 45% decrease with the addition of 0.045 wt%, whereas the electrical resistance of Pb-Sn solders was increased unlike the study by Talas et. al [27] where ten times more active carbon particles were used. There are research results in the literature suggesting that the resistance of lead-free solders with CNT (Carbon Nano Tube) is reduced [31,32], but the literature is limited for active sub micron sized or activated carbon added lead based solders.…”

Section: Electrical Resistivitymentioning

confidence: 99%

“…The effect of chemically inert additives, such as Alumina and TiO2, against the grain refinement and the growth of intermetallic phases is positive, but its behavior in flux is negative [21,29]. The use of active sub micron particles were studied on Pb-Sn and Sn-Cu (0.3 % and 3 %) type lead free alloys by Talas et al [27] with varying amounts of active carbon additions (0.14 wt% and 0.3 wt%) produced from orange peels using a reactor operated at approximately 2 Bar. The study showed that the addition of active carbon particles improved the electrical and hardness properties of solders but there was no microscopically considerable difference in lead free solders.…”

Section: Introductionmentioning

confidence: 99%

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The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles

TALAŞ,

ÖZKAN,

AYAR

2023

Journal of Polytechnic

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Soldering is performed in order to easily assemble electronic components and also to provide electrical conductivity. The strengths, hardness, physical properties and electronic properties of the solders, i.e. reduced energy loss, hardness, melting point and longer service life, can be achieved when their usage is improvised by the help of necessary alloying or neutral additions. In this study, the effect of the addition of sub micron sized activated carbon on the mechanical, physical and electrical properties of industrially used solders, i.e. Pb-Sn and lead free SC0.7 solder was investigated.The thermal studies showed that the melting point of Pb-Sn was lowered against lead free solders with increasing amount of activated carbon. The tensile shear strength of both solders did not improve with increasing amount of activated carbon. In lead-free solders, the electrical resistance values decrease with respect to increasing active carbon ratio, however, the resistance of Pb-Sn solders increased. The addition of active particles have positively affected the microstructure of Pb-Sn solders, resulting in a finer grains, whereas, the addition of active carbon particles have no effect on the grain structures of lead free solder.

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Section: Electrical Resistivitymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles

TALAŞ,

ÖZKAN,

AYAR

2023

Journal of Polytechnic

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Effects of alloying elements on the dissolution and diffusion of Bi in Sn: A first-principles study

Sun

Jiang

Wang

et al. 2021

IOP Conf. Ser.: Earth Environ. Sci.

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Interfacial Bi segregation in Sn-based solders is a critical issue that affects the reliability of solder joints. Doping alloying elements into Sn-Bi solders is considered as a potential way to improve the Bi precipitation. We provided insights into the mechanism of Bi segregation at the atomic scale, by calculating the dissolution and diffusion energies of Bi in the Sn bulk. Importantly, we investigated the effects of alloying elements on the Bi dissolution and diffusion, which varies much with element species. The addition of elements such as Pt, Pd, and Au could enhance the dissolution and weaken the diffusion of Bi in the Sn bulk, thus suppressing the interfacial Bi segregation to some extent. However, other elements such as In, Ag, Sb, and Ga have slight impacts on the dissolution and diffusion of Bi. The bonding characters between the third elements, Bi, and Sn atoms explain different influences of alloying elements on Bi segregation in Sn-based solders.

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Sn-Pb and lead free solders containing active carbon particles

Cited by 2 publications

References 13 publications

The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles

The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles

Effects of alloying elements on the dissolution and diffusion of Bi in Sn: A first-principles study

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