Sn–Ag–Cu Soldering Reliability as Influenced by Process Atmosphere

Baated, Alongheng; Jiang, Junxiang; Kim, Keun Soo; Suganuma, Katsuaki; Huang, Shangyu; Jurcik, B.; Nozawa, S.; Ueshima, Minoru

doi:10.1109/tepm.2009.2035442

Cited by 12 publications

(10 citation statements)

References 6 publications

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“…From Figure 6, it can be deduced that the simulation results obtained matched the experimental results by the study of Baated et al, [23] and meet the minimum requirement of IPC-A standard at 0.089mm for the fillet height at the terminal of the component with IMC layer formed between the copper pad and solder fillet. 3.2 Nanoparticles Distribution Table 5 and Table 6 shows 2D view of the cross-sectioned view of the model VOF solution solder flow with distributed nano-particles weight percentages of 0.01%, 0.15% and 0.15% at different peak temperature.…”

Section: Validation Of Experimental With Simulationsupporting

confidence: 71%

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Effect of Peak Temperature on SAC Nano-Reinforced Fillet Height

Mukhtar¹,

Abas²,

Ani³

et al. 2020

CFDL

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Recently, the addition of new materials into the conventional solder pastes provides a viable solution to optimize the material characteristics and properties of the nanoparticle filled solder paste. Addition of titanium oxide (TiO2) nanoparticles shown that it can enable better performance of the solder. However, actual industry experiment in terms of its optimum thermal profile for improved strength through good spread of nano-particles in the solder is very costly and lengthy to set up. Hence, this paper presents a preliminary study of the interaction between two models of numerical simulation namely volume of fluid (VOF) and discrete phase model (DPM) then compare with previous experimental data. This paper aims to analyse the effect of peak temperature towards the fillet height of ultra-fine SnAg -Cu (SAC) solder joints doped with TiO2 nanoparticles in an electronic assembly. For the purpose of this research, the weight percentage of the nanoparticles TiO2 with the SAC305 lead-free reinforced solder is varied at different peak temperature and investigated in terms of particles distribution, fillet height and thermal strain. This paper presents a 3D numerical simulation of nano-reinforced lead (Pb)-free solder at the ultra-fine joint component for 01005 capacitor with dimension of 0.2 x 0.2 x 0.4 mm³. The results obtained are confirmed by conducting an experiment using a field emission scanning electron microscope (SEM) joined with an EDS and X-ray diffraction machine. This study concludes that the best fillet height would be obtained at 250°C. The distributions of nanoparticles with 0.01 wt%, 0.05 wt%, and 0.15 wt% of weighted percentage are effectively observed by using the HRTEM analysis. Based on the study, higher temperature of the wetting region that range between 240°C and 255°C results in better particle distributions, and fillet height of the solder by using temperature in that range meets the requirement of IPC standards.

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Section: Validation Of Experimental With Simulationsupporting

confidence: 71%

“…a) Fillet observation from the study (b) IMC layer measurement region (c) IMC layer with solder fillet[23] …”

mentioning

confidence: 99%

Effect of Peak Temperature on SAC Nano-Reinforced Fillet Height

Mukhtar¹,

Abas²,

Ani³

et al. 2020

CFDL

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“…They found that the temperature uniformity (ΔT) across the PCB was different, which depended on the location of the package and heating efficiency of the reflow oven. Moreover, Baated et al (2010) reported that the solder joint reliability was strongly affected by the process atmosphere during the reflow process. The use of nitrogen gas (N 2 ) was stated by Baated et al (2010) as a process atmosphere that has obviously improved the wettablility of the solder joints.…”

Section: Challenges In Modelling the Reflow Soldering Processmentioning

confidence: 99%

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Lau¹,

Khor

Soares

et al. 2016

SSMT

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Purpose The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed. Design/methodology/approach Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process. Findings With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed. Practical implications This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process. Originality/value The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

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“…After wetting and spreading, the solder was cooled immediately and solidified at the welding spot. Moreover, the welding process was achieved under N2 protection, which prevented oxidation at the welding spot and led to improved wetting force at the welding spot [4,5]. The LJSBB process is influenced by several key parameters, two of which are laser energy and N2 pressure.…”

Section: Ljsbb Process and Determination Of The Tin Ball's Diametermentioning

confidence: 99%