Abstract:Recently, the addition of new materials into the conventional solder pastes provides a viable solution to optimize the material characteristics and properties of the nanoparticle filled solder paste. Addition of titanium oxide (TiO2) nanoparticles shown that it can enable better performance of the solder. However, actual industry experiment in terms of its optimum thermal profile for improved strength through good spread of nano-particles in the solder is very costly and lengthy to set up. Hence, this paper pr… Show more
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