“…To control the amount of removal and to achieve an ideal thickness, lapping time is usually adjusted between runs. More about this process is also introduced in Li, Wang, and Yeh (2013) and Lin and Wang (2012) In a case in which wafer thickness before and after lapping are both known online, classical run-to-run controllers, such as an exponentially weighted moving average (EWMA) controller and its extensions (Ingolfsson and Sachs 1993;Tseng, Tsung, and Liu 2007), a double EWMA controller (Chen and Guo 2001) and other controllers (Fan et al 2002;Fan 2005;He, Wang, and Jiang 2009;Jin and Tsung 2009;Jen, Jiang, and Wang 2011), can be applied to generate recipes and to guide setting adjustments between runs. However, in the lapping process, accurate thickness values must be measured in a special inspection room with the aid of an expensive testing machine, which is both costly and timeconsuming.…”