Smartphone-assisted energy efficient data communication for wearable devices

Li, Jiwei; Peng, Zhe; Gao, Shang; Xiao, Bin; Chan, Henry C. B.

doi:10.1016/j.comcom.2016.08.011

Cited by 18 publications

(13 citation statements)

References 8 publications

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“…It can not only be connected to smartphones, watches, and other electronic devices through wired transmission but also interact with one or more devices through wireless communication, thus realizing a high degree of freedom and flexibility for users, with the characteristics of convenience, intelligence, and real-time. [1][2][3] TPU is a kind of polymer elastomer between plastic and rubber, which has good flexibility and excellent elasticity and is often used as a flexible material. 4 However, the traditional molding process has some shortcomings, such as low molding precision and simple molding structure, and it is difficult to meet the preparation of smart wearable device materials with complex shapes and structures.…”

Section: Introductionmentioning

confidence: 99%

“…With the rapid development of 5G communication technology and microelectronic chip integration technology, smart wearable devices with good heat dissipation performance are becoming more and more important. It can not only be connected to smartphones, watches, and other electronic devices through wired transmission but also interact with one or more devices through wireless communication, thus realizing a high degree of freedom and flexibility for users, with the characteristics of convenience, intelligence, and real‐time 1–3 …”

Section: Introductionmentioning

confidence: 99%

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The combination of AlN and h‐BN for enhancing the thermal conductivity of thermoplastic polyurethane composites prepared by selective laser sintering

Zhang

Zhao

et al. 2022

J of Applied Polymer Sci

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In recent years, with the rapid development of 5G communication technology and microelectronic chip integration technology, smart wearable devices with high thermal conductivity are becoming more and more important. The most common method to improve the thermal conductivity of polymers is to introduce fillers with high thermal conductivity for compounding and build a thermal conductivity network inside the system. At present, the main methods of preparing heat-conducting composites are hot pressing molding, injection molding, and casting molding, but these traditional molding processes are difficult to prepare heat-conducting composites with complex shapes and structures. Selective laser sintering (SLS) is a new 3D printing technology, which uses the energy provided by laser to melt polymer powder, then sinter layer by layer, stack layer by layer, and finally form printed products. Compared with the traditional molding process, the SLS process has the advantages of a simple manufacturing process, high molding precision, recyclable materials, and wide application, which can realize the design and development of complex structural parts. In this study, TPU composites were successfully prepared by using thermoplastic polyurethane (TPU) polymer as matrix material, AlN and h-BN as thermally conductive fillers, and SLS technology. When the content of AlN is 20 wt% and the content of h-BN is 15 wt%, the thermal conductivity of TPU composite is as high as 0.90 W/mK, which is 391% higher than that of pure TPU sintered parts. At this time, the tensile strength of the composite is 17.2 MPa and the elongation at break is 301%, and it still shows good mechanical properties. This work is devoted to proposing a preparation method of flexible and high thermal conductivity composite materials, which can be used to prepare thermal management materials with complex shapes and structures and carriers of smart wearable devices, and has broad application prospects.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

The combination of AlN and h‐BN for enhancing the thermal conductivity of thermoplastic polyurethane composites prepared by selective laser sintering

Zhang

Zhao

et al. 2022

J of Applied Polymer Sci

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“…Many systems are related to IoT to some extent, such as Smartphone-assisted systems [30,31] for wearable devices, Blockchain-based systems [32][33][34][35] for multi-WSN (Wireless Sensor Networks), privacy-preserving verifiable data sharing, and smart city applications. We can compare them with Zerrouki et al's system and protocol.…”

Section: Zerrouki Et Al's Models Of Puf Protocolmentioning

confidence: 99%

Security of a PUF Mutual Authentication and Session Key Establishment Protocol for IoT Devices

Sun

Tian

2022

Mathematics

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Recently, Zerrouki et al. proposed a Physically Unclonable Function (PUF) mutual authentication and session key establishment protocol for IoT (Internet of Things) devices. Zerrouki et al.’s PUF protocol is interesting because it does not require the storage of any sensitive information on the local memory of the IoT device, which avoids many potential attacks, especially side-channel attacks. Therefore, we carefully investigate the security of Zerrouki et al.’s PUF protocol under the leakage assumption of the session key. Our findings are in the following. First, Zerrouki et al.’s PUF protocol fails to provide known-key security. That is, the adversary can impersonate not only the server to cheat the IoT device but also the IoT device to cheat the server when the adversary corrupts a session key between the server and the IoT device. Second, Zerrouki et al.’s PUF protocol suffers from the key-compromise impersonation attack. It means that the adversary can impersonate the IoT device to cheat the server if the adversary discloses the server’s secret key. Third, Zerrouki et al.’s PUF protocol does not support backward secrecy for the session key. That is, the adversary is always able to derive the session key from the previous session key. We also suggest the root cause of these security flaws in Zerrouki et al.’s PUF protocol. As a case study, our cryptanalysis results would promote a security model for more robust and efficient PUF authentication and session key establishment protocol. Moreover, our idea of the key compromise can be used to evaluate other novel PUF protocol designs.

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“…The third-generation (3G), fourth generation (4G), and fifth generation (5G) technologies are growing fast with many more advancement to fulfill user's streaming requirements and real-time data traffic distribution [2]. These applications are experiencing explosive growth, which is the main cause of burgeoning mobile traffic.…”

Section: Introductionmentioning

confidence: 99%

Big Data Offloading using Smart Public Vehicles with Software Defined Connectivity

Munjal

Liu

et al. 2019

2019 IEEE Intelligent Transportation Systems Conference (ITSC)

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With the explosive increase in the number of mobile devices such as smartphones or laptops, the design of mobile applications becomes increasingly complex, power hungry and resource consuming. Therefore, conventional networks are facing serious problems such as traffic overload and energy consumption due to high traffic demands. As a result, network designers are looking for more options to accommodate numerous data requirements. Aiming to find a promising way to tackle this problem, we are investigating heterogeneous networking architectures, which utilize the existing public transport network as an alternative communication network along with infrastructure-based networks. We propose a heterogeneous network architecture called Software Defined Connectivity (SDC) that utilizes the flow of transport network such as buses, trains, and ferries to start the forwarding process from nearby parking/offloading spots to disseminate data along with conventional networks. Results show that the SDC architecture helps in data offloading over public transport vehicles as per the profiles of each user with significant savings of energy.

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Smartphone-assisted energy efficient data communication for wearable devices

Cited by 18 publications

References 8 publications

The combination of AlN and h‐BN for enhancing the thermal conductivity of thermoplastic polyurethane composites prepared by selective laser sintering

The combination of AlN and h‐BN for enhancing the thermal conductivity of thermoplastic polyurethane composites prepared by selective laser sintering

Security of a PUF Mutual Authentication and Session Key Establishment Protocol for IoT Devices

Big Data Offloading using Smart Public Vehicles with Software Defined Connectivity

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