2019
DOI: 10.1002/aelm.201900314
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Sliding Interconnection for Flexible Electronics with a Solution‐Processed Diffusion Barrier against a Corrosive Liquid Metal

Abstract: The epoch of flexible electronics demands new measures to interconnect electronic components and circuits under mechanical deformations such as bending, rolling, folding, and even stretching. Although liquid metal has been proposed as an alternative to solid‐state solder alloys and conductive adhesives, its corrosive nature rapidly deteriorates the electrical and structural integrity of metallic interconnects and has remained an arduous challenge. A facile solution‐processable method to construct a flexible an… Show more

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Cited by 14 publications
(16 citation statements)
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“…Although copper-based antennas are highly efficient and can withstand moderate bending, they underwent irreversible plastic deformation when stretched by more than 2% [4]. When interfacing with traditional metal interconnects like Cu, Ag, and Al etc., the Ga in the LM alloys is known to cause corrosion and reduces long-term stability of antenna performance [24,36,37]. However, these issues can be addressed by Ni-plating the LM/metal pin interface or by treating it with 1-decylphosphonic acid, by HCl-vapor [36], or with PEDOT:PSS/GO composite [37].…”
Section: Discussionmentioning
confidence: 99%
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“…Although copper-based antennas are highly efficient and can withstand moderate bending, they underwent irreversible plastic deformation when stretched by more than 2% [4]. When interfacing with traditional metal interconnects like Cu, Ag, and Al etc., the Ga in the LM alloys is known to cause corrosion and reduces long-term stability of antenna performance [24,36,37]. However, these issues can be addressed by Ni-plating the LM/metal pin interface or by treating it with 1-decylphosphonic acid, by HCl-vapor [36], or with PEDOT:PSS/GO composite [37].…”
Section: Discussionmentioning
confidence: 99%
“…When interfacing with traditional metal interconnects like Cu, Ag, and Al etc., the Ga in the LM alloys is known to cause corrosion and reduces long-term stability of antenna performance [24,36,37]. However, these issues can be addressed by Ni-plating the LM/metal pin interface or by treating it with 1-decylphosphonic acid, by HCl-vapor [36], or with PEDOT:PSS/GO composite [37]. Furthermore, the development of LM-based nanocomposites has not only resulted in cheaper and reliable fabrication processes but also increases in their electrical properties.…”
Section: Discussionmentioning
confidence: 99%
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“…It has opened new directions in the field of wearable applications [ 150 , 151 ]. In addition, new composite materials, such as a graphene oxide layer combined with poly 3,4-ethylenedioxythiophene: polystyrene sulfonate (PEDOT: PSS), can be utilized [ 152 ]. Therefore, the mixing of high-conductivity composites with low filler contents can increase the electrical and mechanical properties of the materials, like polymer, as shown in Figure 2 .…”
Section: Flexible Materialsmentioning
confidence: 99%