Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps

Kim, Gahui; Son, Kirak; Lee, Janghee; Joo, Young‐Chang; Park, Young-Bae

doi:10.1007/s13391-022-00356-6

Cited by 7 publications

(2 citation statements)

References 33 publications

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“…One approach is to optimize the interconnect structure and use different-shaped solder bumps [27]. Other methods involve reducing the pad opening size and bump height [28] and optimizing the layout of the solder bump array. From the materials' perspective, microalloying and particle reinforcement of the solder bump metals, as well as the design of surface coatings on the substrate, can be employed to improve their performance [29].…”

Section: Electrical Reliabilitymentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.

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Section: Electrical Reliabilitymentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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“…In electronic packaging industries [1], Pb-free Sn-Ag solders have been widely utilized for chip joint processing during the manufacturing of cheaper large-volume consumer products owing to their reasonable costs, good soldering performance, superior mechanical properties, as well as high resistance to thermal fatigue [2,3]. One of the notable reliability challenges in the context of lead-free Sn-based solder alloys is the formation of brittle intermetallic compounds (IMCs) [3][4][5][6][7][8].…”

Section: Introducementioning

confidence: 99%

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

Guo

Kunwar

et al. 2023

Metals

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Synchrotron radiation X-ray imaging technique was applied for in situ observation of Cu6Sn5 intermetallic compounds (IMC) growth in Sn/Cu and Sn-3.5Ag/Cu joints under isothermal temperature conditions of 250/300/350 °C and time duration of 1.5 h. The IMC in Sn-Ag solder was characterized by the formation of grooves during the interfacial reaction, and this can be attributed to the Ag content. Kinetically, the growth rate constants for the height of Cu6Sn5 were observed to increase with temperatures and the presence of Ag in solder. As compared to pure Sn solders, the Sn-3.5Ag solders were observed with interfacial IMC of greater height, smaller base width, and lowered aspect ratio.

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Wearout Reliability-Based Characterization in Memory Packaging

Leong¹,

Chen-Yu²

2023

Springer Series in Reliability Engineering

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Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps

Cited by 7 publications

References 33 publications

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

Wearout Reliability-Based Characterization in Memory Packaging

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