2003
DOI: 10.1016/s0254-0584(03)00201-3
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Size-dependent melting point of noble metals

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Cited by 175 publications
(107 citation statements)
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“…The lower melting point compared to the bulk material is due to the large surface-to-volume ratio, which results in an increase in the surface free energy of the particles [17]. Several calculations were made to determine the melting point of nanoparticles with different size and shape [13,14,[18][19][20]. For bulk gold the melting point is at 1064 °C [21], whereas for gold nanoparticles it can be found below this value.…”
Section: Introductionmentioning
confidence: 99%
“…The lower melting point compared to the bulk material is due to the large surface-to-volume ratio, which results in an increase in the surface free energy of the particles [17]. Several calculations were made to determine the melting point of nanoparticles with different size and shape [13,14,[18][19][20]. For bulk gold the melting point is at 1064 °C [21], whereas for gold nanoparticles it can be found below this value.…”
Section: Introductionmentioning
confidence: 99%
“…This shift is due to melting and subsequent movement of extremely small Au NCs during anneal. Although Au NC anneal temperature is significantly lower than the bulk melting point of Au, due to their small size, the melting point of the NCs is much lower than that of the bulk material [21], [22]. Due to the size-dependent melting temperature, it is possible to melt the smallest Au NCs during NC anneal step, causing them to coalesce together.…”
Section: A Physical Characterizationmentioning
confidence: 99%
“…EDX taken at the center of NC (position 3) is also shown for comparison. Lower melting point of Au NC [21], [22] compared to bulk Au metal causes diffusion of metal atoms into the gate dielectric during NC anneal. Post (Al 2 O 3 ) deposition anneal is also suspected to cause the diffusion of the metal atoms in the film, but the effect is significantly smaller.…”
Section: Physical Failure Mechanismmentioning
confidence: 99%
“…Commercial silver pastes and inks generally provide thin film conductivity up to 2000 S cm À1 , even with annealing temperatures as high as 4200 C [2]. Since the melting points of metal particles drops drastically in the nanometer regime (520 nm), it would thus be possible to significantly lower the annealing temperature of Ag-NPs by reducing their particle size [3,4]. However, the preparation of stabilised Ag-NPs in the sub-10 nm range necessary to enable low-temperature coalescences to conductive elements remains a synthetic challenge.…”
Section: Introductionmentioning
confidence: 99%