2021
DOI: 10.1016/j.actamat.2020.10.057
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Site-specific study of jetting, bonding, and local deformation during high-velocity metallic microparticle impact

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Cited by 48 publications
(15 citation statements)
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“…As Particle 2 rebounds, it can be hit back towards the substrate by an on-coming Particle 3, causing the adhesion of Particle 2 to the substrate. It is *Although an increase in v i increases adhesion and DE, new findings show they decrease at very high velocity [25,26].…”
Section: Mechanisms Of Bonding and Objective Of The Studymentioning
confidence: 96%
See 1 more Smart Citation
“…As Particle 2 rebounds, it can be hit back towards the substrate by an on-coming Particle 3, causing the adhesion of Particle 2 to the substrate. It is *Although an increase in v i increases adhesion and DE, new findings show they decrease at very high velocity [25,26].…”
Section: Mechanisms Of Bonding and Objective Of The Studymentioning
confidence: 96%
“…What causes the departure of v ASI and v jetting from v cr Although v ASI and v jetting can be a good approximation of v cr , there are possible reasons why ASI and jetting could occur prior to bonding, and by extension, the departure of v ASI [129] under the terms of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License; (e) SEM micrographs of impact sites as Cu particle impact Cu substrate at different impact velocities, reprinted with permission from Ref. [25], copyright 2021 Elsevier. In (a-d, f, g), S p and S s are shock wave in particle and substrate, respectively, ϕ is the deflection angle, and α is impact angle or wedge angle.…”
Section: Adiabatic Shear Instability and Jettingmentioning
confidence: 99%
“…In this way, the particles impact the substrate leading to the jetting formation, the oxide layer surrounding the particles is destroyed, and a pure metal-to-metal bond is achieved, resulting in greater deformation of the particles. Note that it is the jetting that leads to the bonding due to a high deformation rate at the particle-substrate interface [105]. Under these conditions, the metallurgical bonding for cold spray, which is connected to adiabatic shear instability to occur, is limited to the metallic substrate; that means that the only possible bonding mechanism for the polymer substrate is the mechanical interlocking.…”
Section: Theories Of Bonding Mechanisms In Cold Spraymentioning
confidence: 99%
“…Moreover, the particle has the phenomenon of fragment, and the fragmentation increases with the increase of the particle impact velocity and impact angle. Tiamiyu et al [10] studied the rebound characteristics of copper particles impacting with copper surface at ultra-high velocity, and they showed that when the incident velocity was between 100 m/s and 590 m/s, the particle recovery coefficient decreased with the increase of incident velocity. Wall et al [11] used Laser Doppler measurement technology to measure the incident velocity and rebound velocity of luciferin ammonium particles in the process of collision with different materials and obtained the critical capture velocity of particles under different working conditions.…”
Section: Introductionmentioning
confidence: 99%