Sintering Mechanism of Composite Ag Nanoparticles and its Application to Bonding Process-Effects of Ag&lt;sub&gt;2&lt;/sub&gt;CO&lt;sub&gt;3&lt;/sub&gt; Contents on Bondability to Cu-

Tatsumi, Hiroaki; Akada, Yusuke; Yamaguchi, Takuto; Hirose, Akio

doi:10.4028/0-87849-463-4.499

Cited by 2 publications

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“…The shell decomposition, by nature an oxidation reaction, also removes the oxide film on the Cu surface (~10 nm in thickness) and makes it possible to bond the nanopartcles to the Cu substrates. The bonding temperature can be further reduced from 300 to 240 o C if Ag 2 CO 3 , as a source of oxygen, is mixed with the Ag metallo-organic nanoparticles [29]. Recently, an organic shell of a mixture of citrate and Ag 2 CO 3 at 1-3 nm in thickness has been developed as coating on pure Ag nanoparticles, which can decompose at much lower temperature [12,13].…”

Section: Solid-state Nanobondingmentioning

confidence: 99%

From Microjoining to Nanojoining

Zhou¹,

Hu²

2010

TOSURSJ

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Abstract:A review is provided of the recent advances and challenges in nanojoining, as compared to microjoining and even regular joining processes. Nanojoining examples are given and analyzed in various joining categories such as solidstate bonding, soldering/brazing and fusion welding. Proposed strategies for nanoassembly and nanojoining, e.g., selforganization and inkjet printing, are also highlighted.

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Section: Solid-state Nanobondingmentioning

confidence: 99%

From Microjoining to Nanojoining

Zhou¹,

Hu²

2010

TOSURSJ

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“…Previous publications only concern with joining of components in power electronics. Especially, joining with nanoparticles as a substitute for soldered joints, which tend to form cracks during thermal cycling, was investigated [14][15][16][17][18][19][20][21][22][23][24][25]. Nevertheless, there is a much greater potential for joining with nanoparticles.…”

Section: Introductionmentioning

confidence: 99%

Low temperature joining of copper by Ag nanopaste: correlation of mechanical properties and process parameters

et al. 2016

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Nanoparticles exhibit a decrease in sintering and melting temperature with decreasing particle size in comparison to the corresponding bulk material. After melting or sintering of the nanoparticles, the material behaves like the bulk material. Therefore, high-strength and temperatureresistant joints can be produced at low temperatures, which is of big interest for various joining tasks. Joints (substrate: Cu) were prepared with an Ag nanoparticle-containing paste. The influence of the adjustable process parameters joining pressure, joining temperature, holding time, heating rate, thickness of paste application, surface treatment, pre-drying process, and subsequent heat treatment on the strength behavior of the joints was investigated. It is shown that in particular, the joining pressure exerts an essential influence on the achievable strengths. In addition, temperature, holding time, and thickness of paste application have a significant effect on strength behavior. In contrast, the pre-drying process, heating rate, surface pre-treatment, and subsequent heat treatment possess hardly any influence on joint strength.

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Sintering Mechanism of Composite Ag Nanoparticles and its Application to Bonding Process-Effects of Ag<sub>2</sub>CO<sub>3</sub> Contents on Bondability to Cu-

Cited by 2 publications

References 0 publications

From Microjoining to Nanojoining

From Microjoining to Nanojoining

Low temperature joining of copper by Ag nanopaste: correlation of mechanical properties and process parameters

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