Sintered Behaviors and Electrical Properties of Cr50Cu50 Alloy Targets via Vacuum Sintering and HIP Treatments

Abstract

Powder metallurgy is the conventional process for the production of CrCu alloys. Enhanced vacuum sintering techniques and the use of HIP processes can be applied to obtain higher densities and decreased porosity in the sintered parts. In this study, the optimal sintering process of Cr50Cu50 alloy targets is 1270°C for 1 h; a high density and low electrical resistivity of the alloy targets is obtained. The experimental results also indicate that the relative density of the Cr50Cu50 vacuum sintering targets can reach 99.42%, and that apparent porosity decreases to 0.54% after 1050°C at 175 MPa for 4 h of HIP treatments. The crystal property of sintered CrCu alloy is improved, and the resistivity decreased to 589 © 10 ¹8 ³·cm; IACS is also enhanced to 29.27% via HIP optimal treatment. This study shows that the high density and optimum properties of sintered Cr50Cu50 alloy targets can be produced by utilizing a suitable HIP treatment.

Investigation of Submicron Powder Fabricated Cr50Cu50 Alloys Using Various Vacuum Hot-Press Sintering Temperatures

“…In this research, hot-press sintering was effective in providing the driving force of the sintering mechanism and helping the atomic diffusion due to external pressure (12 MPa). Therefore, the Cr50Cu50 alloys could achieve a good sintering effect at a relatively low temperature (1050°C) as compared with our previous vacuum sintering study 7) (the optimal vacuum sintering temperature of Cr50Cu50 alloy is 1270°C). When the hot-press sintering temperature was increased to 1100°C, the relative density and apparent porosity showed no obvious change.…”

“…The major diffractions appeared in the Cr (110), (200) and Cu (111), (200), (220) planes, respectively. Due to the crystal structure dependence on the XRD diffraction intensity, 6,7) it was reasonable to suggest that all Cr50Cu50 alloys possessed a good crystalline property after hot-press sintering under the different temperatures. Significantly, the two thermodynamically immiscible metals of chromium and copper produced no alloy phases after the hotpress sintering processes; only the pure chromium and copper peaks appeared in the XRD patterns, as shown in Fig.…”

Investigation of the Characteristics of Submicron-Structured Powder-Fabricated Cr50Ni50 Alloys <i>via</i> Different Hot-Press Sintering Pressures

“…A previous study has also proven the relationship of the relative density of Cr-based alloys to the electrical properties. 20) Increasing the relative density signi cantly improved the electrical properties of the Crbased alloys. Thus, it could be inferred that the higher relative density and lower porosity of the hot-press sintered Cr50Ni50 alloys led to the increase in the mean free path of the electrons, which improved the electrical performance.…”

Replication of microchannel structures in WC–Co feedstock using elastomeric replica moulds by hot embossing process

“…Our previous study indicated that when the sintering temperature increased, the relative density rapidly increased, and the apparent porosity clearly decreased [54,56]. Fig.…”

“…When the temperature was increased to 1200°C and then 1300°C, the surface roughness ratio of the WC-Co alloys was rapidly reduced. The surface roughness ratio appeared in the 1410°C sintering for 1 h; this result indicated that the sintering temperature was close to the liquid-phase sintering temperature [56]. Thus, the sintering temperature approached the liquid-phase sintering temperature for tungsten carbides, which would enhance the volume shrinkage ratio and lead to good sintering materials.…”