2003
DOI: 10.1016/s0040-6090(03)00196-2
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Single source precursors for fabrication of I–III–VI2 thin-film solar cells via spray CVD

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Cited by 78 publications
(58 citation statements)
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“…Currently, these processing issues are primarily addressed for high-efficiency devices by using multistep vacuum-based techniques (e.g., evaporation or sputtering). [9][10][11][12] Several solution-based approaches have also been reported, including (with best power conversion efficiencies achieved) electrochemical deposition (7% for all elements deposited at once, 9% for deposition of metals followed by a separate hightemperature selenization step), [13][14][15] spray pyrolysis/spray chemical vapor deposition (CVD) ( 5%), [16,17] and nanoparticle-precursor deposition (14%). [18][19][20] Limitations of previously reported solution-based CIGS deposition approaches include: (i) incorporation of carbon, oxygen, and other impurities from the precursors or starting solutions; (ii) the need for multistep processing (e.g., a typical nanoparticle process involves making metal oxide nanoparticles, depositing the oxides as films, reducing the films to metals using a hightemperature reduction step, followed by high-temperature selenization); [19,20] (iii) the requirement for a high-temperature selenization/sulfurization step using toxic gases (e.g., H 2 Se) and/or a post-deposition cyanide-bath etch to achieve adequate grain growth and improve phase purity; and (iv) difficulty incorporating dopants such as Ga in a uniform and controllable fashion.…”
mentioning
confidence: 99%
“…Currently, these processing issues are primarily addressed for high-efficiency devices by using multistep vacuum-based techniques (e.g., evaporation or sputtering). [9][10][11][12] Several solution-based approaches have also been reported, including (with best power conversion efficiencies achieved) electrochemical deposition (7% for all elements deposited at once, 9% for deposition of metals followed by a separate hightemperature selenization step), [13][14][15] spray pyrolysis/spray chemical vapor deposition (CVD) ( 5%), [16,17] and nanoparticle-precursor deposition (14%). [18][19][20] Limitations of previously reported solution-based CIGS deposition approaches include: (i) incorporation of carbon, oxygen, and other impurities from the precursors or starting solutions; (ii) the need for multistep processing (e.g., a typical nanoparticle process involves making metal oxide nanoparticles, depositing the oxides as films, reducing the films to metals using a hightemperature reduction step, followed by high-temperature selenization); [19,20] (iii) the requirement for a high-temperature selenization/sulfurization step using toxic gases (e.g., H 2 Se) and/or a post-deposition cyanide-bath etch to achieve adequate grain growth and improve phase purity; and (iv) difficulty incorporating dopants such as Ga in a uniform and controllable fashion.…”
mentioning
confidence: 99%
“…When complete evaporation of solvents is achieved before the droplets contact the surface (especially in the case of volatile precursors), this method is called Spray CVD (chemical vapor deposition). [66,67] While the possibility to avoid subsequent hightemperature anneal is advantageous in these spray-growth methods (notably distinguished from spray coating), they require precise process control and generally longer deposition times than sequential direct liquid coating approaches. In addition, residual aerosols and/or vapors account for lower materials utilization and require enhanced safety and environmental precautions.…”
Section: Non-vacuum Deposition Methodsmentioning
confidence: 99%
“…Spray pyrolysis and Spray-CVD have been used for the deposition of CuInS 2 [65][66][67] as well as oxides that were later treated in chalcogen vapor to form CuInSe 2 . [68,69] Power conversion efficiencies of up to 5 % have been reported using this approach.…”
Section: Non-vacuum Deposition Methodsmentioning
confidence: 99%
“…To this target, many studies have focused on finding the correlation between properties and preparation method and its conditions. CuInS 2 thin films have been deposited by various techniques, such as coevaporation [4], molecular beam deposition [5], chemical vapour deposition [6], spray pyrolysis [7], chemical bath deposition [8], ion layer gas reaction [9], electrodeposition [10], solution-controlled growth [11] and solvothermal deposition [12]. In this work, CuInS 2 films were deposited by the pulse plating technique at different duty cycles in the range of 6-50% and the films were characterized for their structural, optical and electrical properties.…”
Section: Introductionmentioning
confidence: 99%