“…In our opinion, these facts indicate that, for the thicker film, subsurface boiling takes place, which is, among other physical and chemical factors, the main driving process not only for microbump and nanojet formation on surfaces of thin films [2,10,12], but also for surface spallation in bulk materials [13,14]. One possible reason for subsurface boiling can be the sub surface temperature maximum [5,[18][19][20][21][22][23], emerging on a sub nanosecond timescale within a thick film owing to a balance of heat conduction and intense evaporative cooling, as experimentally demonstrated in [15].…”