“…Therefore, more rigorous physical origin of NBS-induced g DA (E) decrease would be validated as further research besides ozone (O 3 ) as the well-known origin of the accepter states [11]. In the present work, all these experimental DOS redistributions of g DA (E) and g TD (E) are well fitted with the acceptable error margins by DOS model as [6] …”
Section: Device Fabrication and Nbs Characteristicssupporting
confidence: 60%
“…3(a) shows the distributions of the subgap DOS (g(E)) as a function of an energy from the valence band maximum (E v ) of the polymer semiconductor. The experimentally extracted g(E) distributions from the reproducible MPCV technique based on the equivalent circuit model with C-V measurement [6] indicate that the acceptor-like deep states g DA (E) of Gaussian profiles with the peak energy (E DA ) are suppressed moving toward mid-gap from E DA = 0.05 eV to 0.1 eV and the exponential donor-like tail states g TD (E) near the band edge (E v ) increase as t NBS is applied and increased [inset of Fig. 3(a)].…”
Section: Device Fabrication and Nbs Characteristicsmentioning
confidence: 99%
“…For quantitative analysis, sub-bandgap density-of-states (DOS) in the polymer channel of the fabricated PTFTs are extracted from the monochromatic photonic capacitance-voltage (MPCV) technique [6] according to the various t NBS . Then, in addition to the charge trapping into the gate oxide and interface, the effects of DOS redistribution and the source/drain contact resistance (R SD ) on the NBS instability will be discussed as the main origins quantitatively.…”
The physical origins of the negative-bias stress (NBS) instability in polymer-based thin-film transistors have been characterized. Through the quantitative analysis by TCAD simulation for the NBS time-dependent experimental results, the threshold voltage (V T )-shift by sub-bandgap density-of-states redistribution forms 70% and 78% for the measured total V T -shift while V T -shift by gate oxide charge trapping only takes 30% and 22% at NBS time of 3000 and 7000 s, respectively. In addition, the increase of source/drain Schottky contact resistance (R SD ) is the main reason for NBS-induced ON-current (I ON ) degradation.
“…Therefore, more rigorous physical origin of NBS-induced g DA (E) decrease would be validated as further research besides ozone (O 3 ) as the well-known origin of the accepter states [11]. In the present work, all these experimental DOS redistributions of g DA (E) and g TD (E) are well fitted with the acceptable error margins by DOS model as [6] …”
Section: Device Fabrication and Nbs Characteristicssupporting
confidence: 60%
“…3(a) shows the distributions of the subgap DOS (g(E)) as a function of an energy from the valence band maximum (E v ) of the polymer semiconductor. The experimentally extracted g(E) distributions from the reproducible MPCV technique based on the equivalent circuit model with C-V measurement [6] indicate that the acceptor-like deep states g DA (E) of Gaussian profiles with the peak energy (E DA ) are suppressed moving toward mid-gap from E DA = 0.05 eV to 0.1 eV and the exponential donor-like tail states g TD (E) near the band edge (E v ) increase as t NBS is applied and increased [inset of Fig. 3(a)].…”
Section: Device Fabrication and Nbs Characteristicsmentioning
confidence: 99%
“…For quantitative analysis, sub-bandgap density-of-states (DOS) in the polymer channel of the fabricated PTFTs are extracted from the monochromatic photonic capacitance-voltage (MPCV) technique [6] according to the various t NBS . Then, in addition to the charge trapping into the gate oxide and interface, the effects of DOS redistribution and the source/drain contact resistance (R SD ) on the NBS instability will be discussed as the main origins quantitatively.…”
The physical origins of the negative-bias stress (NBS) instability in polymer-based thin-film transistors have been characterized. Through the quantitative analysis by TCAD simulation for the NBS time-dependent experimental results, the threshold voltage (V T )-shift by sub-bandgap density-of-states redistribution forms 70% and 78% for the measured total V T -shift while V T -shift by gate oxide charge trapping only takes 30% and 22% at NBS time of 3000 and 7000 s, respectively. In addition, the increase of source/drain Schottky contact resistance (R SD ) is the main reason for NBS-induced ON-current (I ON ) degradation.
“…Quantitative analyses are carried out by the combination of extracted sub-gap density of states (DOS) and device simulation. [12][13][14][15] Studies indicate that peroxide formation reflects well the observed behavior of the TFT under NBIS.…”
Articles you may be interested inChannel length dependence of negative-bias-illumination-stress in amorphous-indium-gallium-zinc-oxide thin-film transistors
“…Although there are many works for extracting the density of states (DOS) [8][9] or the parasitic resistance [10], there are very few used for the electrical parameter extraction, which actually need TCAD simulations although they are also based on an empirical mobility model [11].…”
Based on a Gaussian distribution for the subgap states of amorphous InGaZnO transistors, a new methodology is developed for the extraction of the electrical parameters of the transistors. The calculated non-linear Y-function is transformed to a linear one, adopting a mobility model that fits the classical methodology of Y-function traditionally used in MOSFETs. The efficiency of the new Y-function is verified in experimental data, for the extraction of the electrical parameters of the transistor as the threshold voltage, the on-voltage, the mobility, and the characteristic decay energies of the exponential distributions used to simulate the Gaussian distribution. All the transfer characteristics are reconstructed using only the transfer characteristic for V d =0.1V and the extracted electrical parameters of the transistor.
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