Single-Pass and Multi-Pass Laser Cutting of Si–SiC: Assessment of the Cut Quality and Microstructure in the Heat Affected Zone

Abstract

Experimental investigations on the laser cutting of thick silicon infiltrated silicon carbide (Si–SiC) elements are presented. Si–SiC is a fully dense ceramic composite with high hardness and chemical and thermal stability, which makes it a valuable material in severe conditions. However, machining is still a challenging task. A pulsed Nd:YAG laser was employed to explore the quality of different techniques for the laser cutting of Si–SiC elements with a thickness of 6 mm. In this work, the feasibility of a single-pass technique in comparison with a multi-pass laser cutting was explored for different processing parameters and using both inert and reactive assist gas. A systematic evaluation of the cut quality was assessed by examination of the cross section of samples by optical and electron microscopy, compositional microanalysis, and Raman spectroscopy.

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Laser Corrosion of TiN-TiB2 Ceramics

“…Nonetheless, coincidence of such unique features as high melting temperatures, chemical, corrosion and radiation resistances, etc., makes it possible to exploit those ceramics as working elements in various fields of technology [1][2][3][4], where it often required shaping blanks accordingly. In order to overcome difficulties of machining, nowadays are increasingly moving to laser machining such ceramics [5][6][7][8][9][10][11][12]. Practically in all works, the main attention is paid to the morphology of the resulting surface and the temperature distribution in zone of irradiation whereas processes of underlying physics and chemistry occurring there are practically not analyzed.…”

Laser crack-free cutting technique for thick and dense ceramics

“…Research on laser crack-free cutting of ceramics, especially for the thicker workpieces, has always been paid great attention [1][2][3][4][5][6][7][8][9][10][11][12][13]. But the developments have been made very little since those first trials.…”