Laser crack-free cutting technique for thick and dense ceramics

Ji, Lingfei; Yan, Yinzhou; Bao, Yiwang; Jiang, Yijian

doi:10.1109/cleopr.2009.5292746

Cited by 5 publications

(2 citation statements)

References 13 publications

(10 reference statements)

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“…When the energy density of a condense laser light is over a certain threshold irradiated on a work piece, it ablates, and as a result, it is cut. Different methods of laser cutting are presented in [7,8,9,10], for various materials and applications. Process threshold and cut depth varies depending on the material.…”

Section: Wafer Laser Groovingmentioning

confidence: 99%

Introduction of Laser Grooving Technology for Wafer Saw Defects Elimination

Sumagpang¹,

Gomez²

2019

JERR

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The technical paper showcased a comprehensive study on laser (light amplification by stimulated emission of radiation) grooving as breakthrough and ultimate solution in wafer sawing. The project is intended to address various defects such as chippings, metal dangling/peel off, cracks, and other wafer-related defects induced during wafer sawing process. Series of process simulations, actual processing, benchmarking, and collaborations with suppliers are carried out to attain a zero defect in wafer sawing. Critical processes and controls on this new technology are shown and how the mentioned defects are properly addressed. The laser grooving is the newest and latest developed state-of-the-art technology over conventional mechanical sawing using blades. Sawing process is considered as one of the challenges in the plant as it deals with different wafer technologies. Different blade types also need to be properly maintained. Compared to the conventional and universal mechanical sawing using blades, complex errors and top reject contributor of identified critical processes are corrected and required process capability index is achieved.

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Section: Wafer Laser Groovingmentioning

confidence: 99%

Introduction of Laser Grooving Technology for Wafer Saw Defects Elimination

Sumagpang¹,

Gomez²

2019

JERR

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“…With CO 2 lasers holes are usually cut rather than drilled which leads to larger diameters as compared to percussion or single pulse drilling. Yan et al (2012) have shown that using a digitally modulated 3.5 kW CO 2 laser it is possible to cut holes in 4.4 mm thick alumina, while Ji et al (2009) employed a 3.5 kW CO 2 laser and cut holes in 10 mm alumina. However, due to the long wavelength (large beam parameter product) both studies reveal problems in cutting bore diameters smaller than 100 m. In addition, Yan et al (2012) showed adverse impacts of a larger heat affected zone (HAZ) with associated changing of the aluminium-oxygen atomic ratio.…”

Section: Introductionmentioning

confidence: 98%