Single-package 5GHz WLAN RF module with embedded patch antenna and 20dBm power amplifier

Ryckaert, Julien; Brebels, S.; Côme, B.; Diels, W.; Hauspie, D.; Stoukatch, Serguei; Vaesen, Kristof; Raedt, W. De; Donnay, S.

doi:10.1109/mwsym.2003.1212546

Cited by 15 publications

(8 citation statements)

References 8 publications

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“…It was originally proposed and demonstrated at frequencies below 6 GHz [6][7][8][9][10] and has been recently recognized as the most promising packaging solution to single-chip 60-GHz radios for low-power highspeed wireless communications [11][12][13][14][15][16][17].…”

Section: Package Conceptmentioning

confidence: 99%

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A COMPACT PACKAGE WITH INTEGRATED PATCH ANTENNA FOR SINGLE-CHIP 60-GHz RADIOS

Wai¹,

Chua²,

Lu³

et al. 2011

PIER C

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Abstract-This paper presents the development of a standard surface mountable ceramic ball grid array (CBGA) package with an integrated patch antenna in low temperature cofired ceramic (LTCC) technology for emerging single-chip 60-GHz radios. It addresses the challenges of low-loss wire bonding interconnections required between the chip and the antenna as well as the package to allow efficient utilization of available space for miniaturization. The compact package of size 12.5×8×1.265 mm 3 achieves good electrical performance. For instance, the package part exhibits insertion loss < 0.08 dB, return loss > 22 dB, and attenuation rate < 0.2 dB/cm below 5 GHz; while the antenna part demonstrates 8-GHz impedance bandwidth and 8 ± 2 dBi peak realized gain at 60 GHz. Simulated and measured results are compared. They agree reasonably well, indicating the feasibility of designing and manufacturing the integrated antenna package in LTCC for millimeterwave applications.

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Section: Package Conceptmentioning

confidence: 99%

“…The radio die is adhered to the cavity base of the package ground plane. This configuration will contribute to the shielding of the radio die from the antenna [8]. The signals from the radio die are connected to the antenna through bond wires in a ground-signal-ground (G-S-G) configuration.…”

Section: Design Considerationsmentioning

confidence: 99%

A COMPACT PACKAGE WITH INTEGRATED PATCH ANTENNA FOR SINGLE-CHIP 60-GHz RADIOS

Wai¹,

Chua²,

Lu³

et al. 2011

PIER C

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“…A variety of passive components, including inductors, transformers, resistors and capacitors, can be embedded in the carrier substrate, diminishing or avoiding this way the use of external discrete components. Actually, RF building blocks as well as transceiver modules have been already implemented using the SiP approach [14][15][16] . However, to optimize the fabrication process further studies should be carried out in areas such as Chip/Package co-design methodology or mechanical, thermal and electromagnetic characterization of small packages.…”

Section: Introductionmentioning

confidence: 99%

<title>Low-power short-range transceivers for sensor network applications (Keynote Address)</title>

López-Villegas¹

2005

SPIE Proceedings

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Emerging technologies like ZigBee or Ultra Wide Band (UWB) Radio, based on the new standards of the IEEE 802.15 family, will, in a near future, compete with and/or complement Bluetooth technology in the development of Wireless Personal Area Networks (WPAN's), capable to satisfy the increasing demand of high bit rate data transfer links as well as low power and small size constrains. Nowadays coexistence and interconnectivity of Wireless Local Area Networks (WLAN's), WPAN's and mobile phones is just the first step towards the implementation of the so called Ambient Intelligence. The main characteristics of this new paradigm are: ubiquity, transparency, and intelligence. In this context, sensor networks are the first front of the communication chain. Thus, most of the wireless data transfers will take place at very short distances and most of the information flow will be performed at very low rates. To implement the RF transceiver devices constituting sensor networks in an Ambient Intelligence environment, several challenges still need to be solved, among them: packaging (SoP vs. SoC approaches), powering (low power, batteryless systems, energy scavenging) and system architecture (new simplified direct conversion approaches). All these matters will be considered in this work.

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“…a BGA anyway, this laminate packaging technology brings also a solution for the integration of PA and antenna. As a demonstrator, we have integrated a GaAs PA, a GaAs TX/RX switch, high-quality RF MCM-D filters, a BiCMOS IC containing an LNA and a PPA together with a patch antenna [14].…”

Section: Sip Technologymentioning

confidence: 99%

4G terminals: how are we going to design them?

Craninckx¹,

Donnay²

Proceedings 2003. Design Automation Conference (IEEE Cat. No.03CH37451)

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Fourth-generation wireless communication systems (4G) will have totally different requirements than what front-end designers have been coping with up to now. Designs must be targeted to multi-mode and reconfigurability, leading to the concept of a "software-defined radio". A large part of such a radio will be integrated into a complex SoC, where the substrate noise coupling problem must be solved.However, for an optimal implementation of the complete system, including e.g. PA, RF filters and antenna, different technologies must be combined in a single package, merging the worlds of microwave 's-parameter' designers and IC 'spice' designers. Design and simulation environments efficiently combining the assets of both are needed.At the same time, optimized mixed-signal radio architectures including digital compensation techniques that overcome the limitations and inaccuracies of the analog front-end must be developed. Again, efficiently designing and simulating such mixed analog/digital architectures requires an optimized tool capable of combining RF simulation techniques with digital system model simulation.

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Single-package 5GHz WLAN RF module with embedded patch antenna and 20dBm power amplifier

Cited by 15 publications

References 8 publications

A COMPACT PACKAGE WITH INTEGRATED PATCH ANTENNA FOR SINGLE-CHIP 60-GHz RADIOS

A COMPACT PACKAGE WITH INTEGRATED PATCH ANTENNA FOR SINGLE-CHIP 60-GHz RADIOS

<title>Low-power short-range transceivers for sensor network applications (Keynote Address)</title>

4G terminals: how are we going to design them?

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