A COMPACT PACKAGE WITH INTEGRATED PATCH ANTENNA FOR SINGLE-CHIP 60-GHz RADIOS

Abstract

Abstract-This paper presents the development of a standard surface mountable ceramic ball grid array (CBGA) package with an integrated patch antenna in low temperature cofired ceramic (LTCC) technology for emerging single-chip 60-GHz radios. It addresses the challenges of low-loss wire bonding interconnections required between the chip and the antenna as well as the package to allow efficient utilization of available space for miniaturization. The compact package of size 12.5×8×1.265 mm 3 achieves good electrical performance. For instance, the package part exhibits insertion loss < 0.08 dB, return loss > 22 dB, and attenuation rate < 0.2 dB/cm below 5 GHz; while the antenna part demonstrates 8-GHz impedance bandwidth and 8 ± 2 dBi peak realized gain at 60 GHz. Simulated and measured results are compared. They agree reasonably well, indicating the feasibility of designing and manufacturing the integrated antenna package in LTCC for millimeterwave applications.

60‐GHz amplitude shift‐keying transceiver LTCC system‐on‐package module

“…Several applications such as wireless local personal network, Gigabit point-to-point (PtP) wireless networks, real-time video streaming, and huge data file transmission have been researched and developed [1][2][3][4][5][6][7][8][9][10][11][12] using unlicensed 60-GHz bands. Especially, recently, for 7 Gbps wireless local area network applications, WiGig [13], standardization process has been in its advanced stage.…”

“…The system-on-package (SoP) modules based on a low-temperature co-fired ceramic (LTCC) technology have been demonstrated to be suitable technology integrating active and passive circuits into a compact single substrate due to its low loss, integration capability, similar temperature coefficient of expansion value to microwave monolithic integrated circuits (MMICs), and cost effectiveness. Various achievements on 60-GHz LTCC package transmitter (Tx) or receiver (Rx) modules [1][2][3][4][5][6][7][8][9][10][11][12] as well as key components such as bandpass filters (BPFs), duplexer, and antennas [9][10][11] have been reported in recent years. A 60 GHz monolithic single-SoP Tx module integrating both a BPF and antenna for improvement of RF-local oscillator (LO) isolation had been developed [1].…”

“…A 60 GHz monolithic single-SoP Tx module integrating both a BPF and antenna for improvement of RF-local oscillator (LO) isolation had been developed [1]. Antenna-in-package integrating antennas in an integrated circuit package have been developed [9][10][11] to investigate the possibility to combine antennas with a highly integrated 60-GHz radio.…”

Signal Integrity and Electromagnetic Broadband Packaging Model Extraction of Full Differential Bandpass Filter on Ipd With Bga Packaging

“…By completing the following procedure, the ideal lump components, including inductance, capacitance, and resistance, can be known. From the formula (1)-(3) [24] and Fig. 14, the time delay, characteristic impedance and effective width of transmission line can be obtained by using physical factor and dielectric factor.…”