Single Metal Deposition of Copper, Cadmium, Zinc and Nickel from Thiosulfate Solutions

Abstract

Deposition from Thiosulfate Solutions" based on work done in partial fulfillment of the requirements for the Ph.D. degree in Chemical Engineering at the University of Minnesota.

Cathodic Deposition of CdTe from Aqueous Electrolytes

“…Cathodic deposition can occur either by deposition of the individual components in the required ratio, or by deposition resulting from discharge and decomposition of a complex containing the two components. The former mechanism has been proposed for formation of CdSe and Ag2Se (4), the latter mechanism was proposed for the cathodic deposition of Ni~S2 from a Ni thiosulfate solution, the proposed cathodic reaction being (5) Nis(S2Q)3 -F 6e--> Ni3S2 ~-$203 = -~ 2SO3 = In the latter case the stoichiometry of the deposit can only be varied if individual deposition of Ni or S atoms also occurs.…”

Electrodeposition of Copper

“…In more recent times the following solutions have been evaluated: sulfate-oxalate-boric acid [18], sulfateoxalate [19,20], Cu 1þ chloride [21], Cu 1þ chloride-sodium thiosulfate [22], benzene disulfonic acid [23], Cu 1þ iodide and bromide [24], iodide and chloride [25], fluoborate [26,27], alkane sulfonic acid [28,29], sulfamic acid [30,31], Cu 2þ formate with ammonium salts [32], phosphatesulfate [33], fluosilicate [34], fluosilicate-silicic acid [35], Cu 2þ glycolate, lactate, malate, and tartrate [36].…”