Simultaneous wick and fluid selection for the design of minimized-thermal-resistance vapor chambers under different operating conditions

Baraya, Kalind; Weibel, Justin A.; Garimella, Suresh V.

doi:10.1016/j.ijheatmasstransfer.2019.03.025

Cited by 17 publications

(2 citation statements)

References 19 publications

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“…88 In addition, the thickness of the wick also decides the VC performance. K. Baraya et al 89 have investigated the effect of thickness and wick and working fluid selection by using analytical and numerical investigation. It was found that as the wick thickness reduces, its impact on the thermal resistance of the VC reduces and becomes negligible for ultra-thin VCs.…”

Section: Factors Affecting Thermal Performancementioning

confidence: 99%

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Chitnis

Dayal

Arora

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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Miniaturization and high performance are the two principal requirements of modern electronics. All commercial applications demand reliable performance at high operational efficiency for prolonged service life. In order to meet all these requirements, the cooling system should be able to handle large heat fluxes packed in compact spaces and take away the heat as soon as possible to avoid overheating of the chip. Phase change heat transfer devices can handle large heat fluxes on account of latent heating. Lately, vapour chambers (VCs) are found to be promising heat spreaders as they are passive two-phase heat transfer devices. They effectively eliminate the hotspots, transferring high heat fluxes with better efficiencies and offer lower thermal resistance compared to the conventional cooling techniques. A detailed review of the latest research and advancements in the field of VCs is presented in this paper, including the effect of different thermo-physical parameters on their performance. Finally, all the major findings are summarized, including the future scope of development in a systematic manner.

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Section: Factors Affecting Thermal Performancementioning

confidence: 99%

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Chitnis

Dayal

Arora

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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“…In another study, Lips et al [19] showed that a thinner vapor core improves the thermal resistance but reduces the capillary limit for an over-filled wick, and hence the vapor core thickness and filling ratio need to be carefully optimized. In our recent work [20], we concluded that the choice of wick and working fluid should be made simultaneously to obtain the optimal thermal performance while utilizing the maximum capillary pressure available, as the total thermal resistance is coupled to both the wick and working fluid properties.…”

Section: Introductionmentioning

confidence: 99%

Heat pipe dryout and temperature hysteresis in response to transient heat pulses exceeding the capillary limit

Baraya

Weibel

Garimella

2020

International Journal of Heat and Mass Transfer

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The balance between the capillary pressure provided by the wick in a heat pipe or vapor chamber and the flow resistance to liquid resupply at the evaporator determines the maximum heat load that can be sustained at steady state. This maximum heat load is termed as the capillary limit; operation at steady heat loads above the capillary limit will result in dryout at the evaporator wick. However, different user needs and device workloads can lead to highly transient heat loads in applications ranging from consumer electronic devices to server processors. In these instances, the operation of heat pipes must be assessed in response to brief transient heat loads which could be higher than the notional capillary limit that governs dryout at steady state. In the current study, experiments are performed to characterize the transient thermal response of a heat pipe subjected to heat input pulses of varying duration that exceed the capillary limit. Transient dryout events due to a wick pressure drop exceeding the maximum available capillary pressure can be detected from an analysis of the measured temperature signatures. It is demonstrated that under such transient heating conditions, a heat pipe can sustain heat loads higher than the steady-state capillary limit for brief periods of time without experiencing dryout. If the heating pulse is sufficiently long as to induce transient dryout, the heat pipe may experience an elevated steady-state temperature even after the heat load is reduced back to a level lower than the capillary limit. The steady-state heat load must then be reduced to a level much below the capillary limit to fully recover the original thermal resistance of the heat pipe. This characteristic temperature hysteresis following transient dryout has significant implications for the use of heat pipes for pulsed power dissipation. Further experiments are performed to bound the range of heat loads over which the temperature hysteresis is present following a transient dryout event.

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Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

Lim

Lee

2021

J Mech Sci Technol

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As the cooling capacity of the active cooling devices has reached their allowable heat flux limit, heat spreading technologies are becoming more remarkable in the thermal management of high-power electronics. Flat plate two-phase heat spreaders (FTHSs) are advantageous for the thermal management of electronic devices due to their simplicity, powerfree operation, and high reliability. This review is based on understanding the working mechanism and limitations of FTHSs. As the power density of electronic devices increases, researchers focus on performance improvement to overcome their malfunctioned working conditions. This review summarizes the major parameters of FTHS that affect heat transfer performance. Moreover, recent advances in FTHSs suggest that new design concepts can extend the maximum operating heat flux of thermal management devices. This review can establish a direction for studying higher-performance heat spreaders and identifying the latest trends.

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Simultaneous wick and fluid selection for the design of minimized-thermal-resistance vapor chambers under different operating conditions

Cited by 17 publications

References 19 publications

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Heat pipe dryout and temperature hysteresis in response to transient heat pulses exceeding the capillary limit

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

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