Simultaneous double side grinding of silicon wafers: a mathematical study on grinding marks

Reciprocating surface grinding of semiconductor wafers: A kinematic model for grinding marks & pattern

“…For the model in this paper, the grinding wheel is assumed to behave like a single-point cutting tool. This assumption has been used by other researchers' publications [4][5][6].…”

“…Figure Several mathematical models have been reported for grinding marks in SSG and SDSG of silicon wafers [4][5]. These mathematical models can potentially be used to study the grinding marks in RSG but few research papers have ever been published.…”

Simultaneous Double Side Grinding of Silicon Wafers: A Further Investigation into Grinding Marks Pattern

“…There are many visible grinding marks on the wafer surface processed by SDSG (7,20). These grinding marks need to be removed by subsequent processes.…”

“…But, it will lengthen the polishing time and introduce more finishing costs. A better approach is to optimize the process so that grinding marks can be removed with the minimum polishing amount (20). The success of the latter approach will be partially dependent upon whether or not the following questions can be answered: How are grinding marks generated?…”

“…When the ratio of the wheel rotation speed (N 1 ) versus the wafer rotation speed (N 2 ) is an integer, all grinding lines are generated within one wafer rotation. This case has been investigated systematically (20). However, when the ratio N 1 /N 2 is not integral, the grinding lines will increase with the increase of wafer rotations.…”