Simulation of Warpage During Fabrication of Printed Circuit Boards

Kim, Sung-Won; Lee, Sanghyuk; Kim, Dae‐Jin; Kim, Sun Kyoung

doi:10.1109/tcpmt.2011.2114662

Cited by 16 publications

(18 citation statements)

References 16 publications

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“…The discrepancy was mainly caused by two reasons: the simplifying of the actual package structure and homogeneity assumption of materials. Since the possible inclusion of minor inaccuracies or uncertain cannot overturn the trends and relative magnitudes of warpage, 15) the simulation results were acceptable.…”

Section: Package Warpage Simulationmentioning

confidence: 93%

“…15,17) In the model, mechanical properties of materials except EMC were assumed to be linearly elastic. The viscoelastic property of EMC was introduced into the simulation and the EMC viscoelastic data measured with Dynamic Mechanical Analysis is revealed in Fig.…”

Section: +1mentioning

confidence: 99%

“…Chiu 14) et al simulated warpage of packages with consideration of the constitutive relationship of an epoxy molding compound (EMC). And Kim 15) et al simulated PCB warpage after patterning process by separately meshing all subparts and proposing a linear thermo elasticity analysis. However, it is noticed that few researches quantitatively investigated the influence of warpage on HiP.…”

Section: Introductionmentioning

confidence: 99%

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Effects of Package Warpage on Head-in-Pillow Defect

et al. 2015

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Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50 µm larger in N 2 than that in air, suggesting that under N 2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.

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Section: Package Warpage Simulationmentioning

confidence: 93%

Section: +1mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Effects of Package Warpage on Head-in-Pillow Defect

et al. 2015

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“…The non-dimensional constants k 4 , k 5 , k 6 and k 7 are set to 1.2, 0.1, 1.15 and 4, respectively. The constants were optimized for the minimization of the differences between FEM and homogenization results.…”

Section: Equivalent Poisson Ratiomentioning

confidence: 99%

“…Warpage is responsible for misalignments during the package assembly stage, smaller tolerances [4], imperfect soldering and consequent detachment of components [4]. In addition, it may induce cracks and the separation of the layers [5].…”

Section: Introductionmentioning

confidence: 99%

Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

et al. 2016

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Abstract. Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

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Sliding Interconnection for Flexible Electronics with a Solution‐Processed Diffusion Barrier against a Corrosive Liquid Metal

Shin

Baek

Song

et al. 2019

Adv Elect Materials

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The epoch of flexible electronics demands new measures to interconnect electronic components and circuits under mechanical deformations such as bending, rolling, folding, and even stretching. Although liquid metal has been proposed as an alternative to solid‐state solder alloys and conductive adhesives, its corrosive nature rapidly deteriorates the electrical and structural integrity of metallic interconnects and has remained an arduous challenge. A facile solution‐processable method to construct a flexible and electrically conductive diffusion barrier on aluminum electrodes, which are vulnerable to liquid metal, is presented. The stacked layers of graphene oxide (GO) in conjunction with poly(3,4‐ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) effectively block the diffusion of liquid metal, where PEDOT:PSS serves as an electrically conducting medium to complement the non‐conductive trait of GO, and as an impeding factor together with GO against the diffusion of liquid metal. A fluidic interconnect using liquid metal and aluminum electrodes with the solution‐processed diffusion barrier of the PEDOT:PSS/GO composite exhibits a better electrical contact property than a conventional interconnect. Finally, a novel proof of concept of sliding interconnection is demonstrated by rolling a carbon nanofiber‐coated liquid metal ball on aluminum electrodes coated with the PEDOT:PSS/GO composite, offering a new opportunity beyond flexibility and stretchability.

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Simulation of Warpage During Fabrication of Printed Circuit Boards

Cited by 16 publications

References 16 publications

Effects of Package Warpage on Head-in-Pillow Defect

Effects of Package Warpage on Head-in-Pillow Defect

Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

Sliding Interconnection for Flexible Electronics with a Solution‐Processed Diffusion Barrier against a Corrosive Liquid Metal

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