Simulation of the dielectric constant of aerogels and estimation of their water content

Xiao, Xia; Streiter, R.; Wolf, Hans Christoph; Ruan, Guozhi; Murray, Christopher P.; Geßner, Thomas

doi:10.1016/s0167-9317(00)00428-7

Cited by 18 publications

(5 citation statements)

References 4 publications

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“…Extensive efforts have been made to prepare and fabricate lowdielectric-constant (low-k) materials that can be used to reduce the resistance-capacitance time delay, cross talk and power dissipation in new generations of high-density integrated circuits [1][2][3][4]. For example, fluorination is a general approach to reduce the dielectric constants of polyimides [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Polyhedral oligomeric silsequioxane monolayer as a nanoporous interlayer for preparation of low-kdielectric films

Liu

Cho

et al. 2007

Nanotechnology

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Polyhedral oligomeric silsequioxane (POSS) monomer was fixed to a silicon surface by reacting octakis(glycidyldimethylsiloxy)octasilsesquioxane (OG-POSS) with the OH-terminated silicon surface in the presence of tin (II) chloride. The POSS cage layer then served as a nanoporous interlayer to reduce the dielectric constants of polyimide films on silicon surfaces. The chemical structure and surface morphology of OG-POSS modified silicon surfaces were characterized with XPS. With the introduction of a POSS nanopored interlayer, the dielectric constants of polyimide films were reduced.

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Section: Introductionmentioning

confidence: 99%

Polyhedral oligomeric silsequioxane monolayer as a nanoporous interlayer for preparation of low-kdielectric films

Liu

Cho

et al. 2007

Nanotechnology

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“…Xiao et al [18] developed a model that predicts the water content in porous silica from the difference between an experimentally determined dielectric constant and one predicted theoretically assuming there is no hydroxyl (OH) in the dielectric. The water content increases the dielectric constant mainly by increasing the orientational (configurational) polarization.…”

Section: Introductionmentioning

confidence: 99%

Effects of sintering on dielectric constants of mesoporous silica

Cho

Saxena

Rodrı́guez

et al. 2004

Journal of Non-Crystalline Solids

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“…Aerogels are highly porous materials with surface areas between 500 and 1600 m 2 /g and densities between 0.002 and 0.8 g/cm 3 (density of air = 0.0012 g/cm 3 ) . These materials display unique physical properties that have made them attractive for thermal and acoustic insulation, low- k dielectric materials , and Cherenkov radiation counters . Unfortunately, the low density and colloidal structure make aerogels too fragile to economically manufacture.…”

mentioning

confidence: 99%

Strong, Low-Density Nanocomposites by Chemical Vapor Deposition and Polymerization of Cyanoacrylates on Aminated Silica Aerogels

Boday

Stover

Muriithi

et al. 2009

ACS Appl. Mater. Interfaces

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Strong polymer-silica aerogel composites were prepared by chemical vapor deposition of cyanoacrylate monomers onto amine-modified aerogels. Amine-modified silica aerogels were prepared by copolymerizing small amounts of (aminopropyl)triethoxysilane with tetraethoxysilane. After silation of the aminated gels with hexamethyldisilazane, they were dried as aerogels using supercritical carbon dioxide processing. The resulting aerogels had only the amine groups as initiators for the cyanoacrylate polymerizations, resulting in cyanoacrylate macromolecules that were higher in molecular weight than those observed with unmodified silica and that were covalently attached to the silica surface. Starting with aminated silica aerogels that were 0.075 g/cm(3) density, composite aerogels were made with densities up to 0.220 g/cm(3) and up to 31 times stronger (flexural strength) than the precursor aerogel and about 2.3 times stronger than an unmodified silica aerogel of the same density.

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Simulation of the dielectric constant of aerogels and estimation of their water content

Cited by 18 publications

References 4 publications

Polyhedral oligomeric silsequioxane monolayer as a nanoporous interlayer for preparation of low-kdielectric films

Polyhedral oligomeric silsequioxane monolayer as a nanoporous interlayer for preparation of low-kdielectric films

Effects of sintering on dielectric constants of mesoporous silica

Strong, Low-Density Nanocomposites by Chemical Vapor Deposition and Polymerization of Cyanoacrylates on Aminated Silica Aerogels

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